Packaging Integration Engineer (2026 New College Graduate)
Core
Support assembly process integration, process development, reliability characterization, and failure analysis for electro-optical transceivers using advanced 2.5D/3D packaging and silicon photonics technologies.
Role type
New College Graduate Packaging Integration Engineer
Builds
Electro-optical transceivers and advanced packaging solutions
Domain
Semiconductor manufacturing / Silicon Photonics / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging fundamentals, Silicon photonics basics, Reliability testing, Failure analysis, Data analysis, Process integration, Design rule development, Experimental design
Preferred skills
DOE methodologies, Statistical data analysis, Thermal/mechanical simulation, Flip-chip/Chiplets/2.5D/3D integration knowledge, Project management, Leadership experience
Technologies
2.5D/3D packaging, Silicon photonics, Flip-chip, Chiplets
Responsibilities
Support assembly process integration for silicon photonics products; Assist with process development and qualification; Analyze engineering data to identify improvements; Participate in failure analysis and root cause investigations; Support package reliability testing; Collaborate with cross-functional teams on technical challenges; Document results and communicate findings.
Seniority
Entry-level, New College Graduate
