CareerPlan

Principal Engineer, IO Design

Boise, Idaho, United States of AmericaFull-time2026-07-31 → 2026-11-10

Core

Design, optimize, and verify high-speed IO and clocking circuits for new DRAM memory products, pushing speed limits and analyzing impairments.

Role type

Principal IC analog/mixed-signal design engineer (IO/Clocking)

Builds

High-speed IO and clocking circuits for DRAM products

Domain

Semiconductor / Memory / Analog & Mixed-Signal

Required skills

Analog and mixed-signal circuit design, High-speed circuit design, Device physics, CMOS processing, Circuit simulation (Cadence), Layout practices, UNIX

Preferred skills

Transceiver design, Channel modeling, Timing budget analysis, Equalization techniques, SI knowledge, Python/Perl scripting, AI/ML usage, Mentoring

Technologies

Cadence, UNIX, Python, Perl

Responsibilities

Innovate, design, optimize and verify high-speed IO and clocking circuits; Apply high-speed circuit design techniques to evaluate IO data path and clocking path; Develop modeling, analysis and simulation methodology; Work with Product Engineering and SI team to compare silicon performance with simulation; Collaborate with process integration and transistor modeling teams.

Seniority

Principal, hands-on IC with mentorship