Electrical Packaging Design Engineer
Core
Design cost-effective, high-performance electrical packages for FPGA devices, translating electrical requirements into manufacturable package technologies.
Role type
Senior IC electrical packaging design engineer
Builds
Organic and PCB package modules for high-speed FPGA chips
Domain
Semiconductor / High-performance computing / FPGA
Required skills
Cadence package design tools, 2D/3D package design and modeling, routing and stack-up analysis, power integrity analysis, SerDes design constraints, DoE, DFM/DFR knowledge, script development for design rules
Preferred skills
SKILL tool knowledge, high power Gbs IO product experience, mentorship of junior designers
Technologies
Cadence, Ansys, AutoCAD, SKILL
Responsibilities
Define package/module design requirements and negotiate specifications with chip/system teams, conduct routing and component placement studies, develop multi-signal package models over 50 GHz bandwidth, perform power integrity analysis for core and IO, maintain electrical design guidelines database
Seniority
Senior, hands-on IC
