Analog IC Design
1,385 open positions
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MTS/Sr. MTS Engineer – Discrete Power FET Technology Development ON SemiconductorHopewell Junction, NY, United States $147k–$147k5mo Lead technology development for onsemi's advanced nodes of discrete power FETs, owning device architecture from concept definition through qualification and high-volume manufacturing.
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Analog Design Engineer MicronHyderabad, Telangana, India 5mo Design, layout, and optimization of Memory/Logic/Analog circuits for next-generation memory products.
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Photonic Packaging Engineer CiscoCarlsbad, California, US $134k–$134k5mo Design, develop, and support next-generation packaging platforms for Cisco's Silicon Photonics Integrated Circuits and chipsets, focusing on electromechanical assemblies and automated manufacturing tools.
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System/Field Application Engineer MediaTekSan Jose, CA 5mo Supporting customer system bring-up, validation, and issue debugging across hardware, firmware, and SDK layers for high-speed interface products.
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Analog Flash Design Engineer Texas InstrumentsBengaluru, Karnataka, India 5mo Design, development, and verification of analog and mixed-signal circuits for embedded Flash Memory IPs, including charge pumps, voltage regulators, sense amplifiers, and memory interfaces.
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Analog Design, Sr Staff Engineer↗ SynopsysPorto Salvo, P11, PT 5mo Design and development of medium to large complexity analog circuits for high-speed SerDes products supporting Ethernet and PCIe standards.
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Senior Standard Cell Library Design Manager IntelMalaysia, Penang 5mo Lead the development and optimization of standard cell libraries for Intel's Foundry Design Technology Platform to support product teams and external customers across all technology generations.
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Application Engineer (DDR5, SPDHUB/TS focus) MonolithicpowerChengdu - China 5mo Develop reference designs, custom PCBs, and prototypes for DDR5 SPD Hub products serving Data Center applications.
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Analog/Mixed-Signal IC Design Co-Op/Intern (Summer 2026) / Stage/Co-Op en Conception de CI Analogiques/Signal Mixte (Été 2026) CadenceMOUNT-ROYAL (Montreal) $0k–$0k5mo Co-op student investigates analog/mixed-signal IC design and simulation techniques on specific circuit blocks.
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SMTS Photonics Advanced Packaging Integration GlobalFoundriesUSA - Vermont - Essex Junction $107k–$107k6mo Lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms, delivering scalable, low-loss architectures for AI, HPC, and data center applications.
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Senior Fiber Coupling Engineer CienaNew Providence - NJ $133k–$133k6mo Lead innovative design, modeling, and hands-on development of micro-optic solutions enabling scalable, high-performance optical interconnects for data centers.
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Senior Layout PCB Engineer EtchedaiHardware Engineering 6mo Designing and optimizing high-performance printed circuit boards (PCBs) for AI chips and data center hardware, focusing on high-speed signaling, power distribution, and complex HDI stack-ups.
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Senior ASIC layout design engineer_BST Bosch-GroupShanghai, Shanghai, cn 6mo Senior ASIC layout design engineer responsible for analog layout from block to top-level IC integration and physical verification for advanced ASICs in MEMS sensors.
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New College Grad - Design Engineer, Circuit Design↗ Micron TechnologySan Jose, CA, US $83k–$83k6mo Design and verify NAND Flash circuits and systems spanning analog and digital domains to ensure robust, manufacturable, high-performance memory products.
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Senior/Principal Signal Integrity Engineer-Silicon Photonics & AI Interconnects LumilensSan Jose 6mo Lead end-to-end signal integrity (SI) and power delivery analysis for complex 2.5D/3D photonic-electronic packages integrating electrical ICs, photonic ICs, and chiplets.
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Principal Engineer, Mixed Signal Design Engineering AnalogdevicesUS, MA, Wilmington $157k–$157k6mo Technical authority driving architecture and technology roadmaps for complex mixed-signal ICs interfacing with MEMS sensors, balancing performance, power, area, and time-to-market.
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Head of Mechanical Design LumentumHong Kong - Science Park 6mo Lead mechanical and packaging design for next-generation 1.6T client-side optical transceivers, focusing on high-speed optical module packaging, thermal management, and COB assembly processes.
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PCB Layout Engineer SkydioSan Mateo, California, United States $148k–$148k6mo Designing complex PCBAs for next-generation autonomous drones, ensuring world-class performance, reliability, and manufactability.
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Senior Mixed Signal Design Engineer NVIDIAUS, CA, Santa Clara $136k–$136k6mo Design high-speed I/O SerDes components (PLL, CTLE, ADC, optics) and adaptation algorithms for NVIDIA's AI, gaming, and autonomous driving SoCs.
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