Analog IC Design
2,194 open positions
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BBU智能化硬件开发工程师 HuaweiShanghai, China 1mo Lead hardware architecture design for 5G/5.5G/6G BBU systems, focusing on high-speed Serdes, DDR memory, power integrity, and thermal reliability to support next-generation base station platforms.
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Principal Analog Design Engineer NxpNoida 1mo Lead the design and development of advanced clock generation, distribution, synchronization, and timing circuits for next-generation SoCs and mixed-signal products.
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Senior Staff RF/Analogue IC CAD Engineer - Farnborough, Qualcomm QualcommFarnborough, United Kingdom 1mo Develop, maintain, and optimize Cadence-based CAD environments, design flows, and methodologies to support the delivery of world-class RF and analogue integrated circuits.
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MTS - HIG HBM - ARCHITECTURE MicronRichardson, TX 1mo Design and standardize end-to-end IO design quality systems for High Bandwidth Memory (HBM) solutions, ensuring silicon learnings are captured and fed back into future generations.
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Product Engineer Texas InstrumentsBengaluru, Karnataka, India 1mo Develop, debug, and characterize analog and mixed-signal integrated circuits for automotive and industrial markets, including amplifiers, temperature sensors, and signal processing ICs.
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Senior Manager - Analog Design Advanced Micro Devices, IncSanta Clara, California 1mo Manage the Memory I/O design team to define, specify, simulate, and implement future LPDDR IPs, focusing on high-speed analog and digital circuit architecture, calibration algorithms, and link performance models.
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Senior Signal Integrity Engineer DrivenetsRaanana, Israel 1mo Ensuring optimal signal integrity for high-speed interfaces including Ethernet, PCIe, and DDR5 through analysis, modeling, and simulation.
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Lead Engineer Analog ASIC Design (f/m/div.) Bosch-GroupRemote €88k1mo Provide technical leadership for analog ASIC design sub-teams, developing next-generation power management solutions for the automotive industry.
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Senior/Principal Optical Packaging Engineer MicrosoftUnited Kingdom, Cambridgeshire, Cambridge 1mo Translate system-level optical, electrical, thermal, and mechanical requirements into package architectures and qualification strategies for next-generation optical and advanced packaging technologies.
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ENGINEERING MANAGER TILL XENERGIC↗ Nexer GroupLund, Skåne County, Sweden 1mo Lead Xenergic's engineering organization to develop high-speed, on-chip memory IP for advanced chip technologies, spanning from transistor-level design to customer integration and mass production.
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Custom Silicon Architect - Camera Hardware AppleCupertino, United States of America 1mo Architect and develop custom silicon ICs for camera systems to enable best-in-class imaging experiences across Apple's product portfolio.
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Platform Hardware Design Engineer IntelUS, Oregon, Hillsboro $164k–$232k1mo End-to-end development of platform hardware, translating system requirements into circuit and component-level specifications.
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Chip-Package Interaction Engineer STMicroelectronicsAgrate Brianza, Italy €38k–€45k1mo Develop new pad/pad over active structures for Smart Power processes and validate chip-package interactions (CPI) through testing and thermo-mechanical simulations.
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Trainee Program – Mixed-Signal IC Design for RF integrated circuits (RFIC) (all genders) Fraunhofer-Gesellschaft e.V. Zentrale MünchenErlangen, BAYERN 1mo Trainee role in mixed-signal IC design for RF integrated circuits, focusing on design, simulation, layout, and verification of data converters, PLLs, and frequency synthesizers.
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Senior Staff Engineer, Layout Design (Power & Analog ICs) Renesas-ElectronicsBengaluru, KA, in 1mo Senior individual-contributor responsible for translating circuit requirements into robust, manufacturable layouts for power and analog IC products (PMICs, regulators, gate drivers, BMS).
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Principal Mixed-Signal Design Engineer, Data Converters K2spacecorporationUnited States - Remote $190k1mo Lead architecture and development of wideband, high-performance data converters and associated analog front-ends for advanced mixed-signal SoCs in high-power satellite platforms.
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Senior Principal Mixed-Signal IC Design Engineer↗ Analog DevicesToronto, Ontario, Canada $157k–$227k1mo Leading the development of high-speed data converters (RF DACs, ADCs, SerDes PHYs) in FinFET processes for SoC integration.
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