Chip-Package Interaction Engineer
Core
Develop new pad/pad over active structures for Smart Power processes and validate chip-package interactions (CPI) through testing and thermo-mechanical simulations.
Role type
IC chip-package interaction engineer
Builds
Smart Power Technology Platforms/Modules
Domain
Semiconductor / Smart Power
Required skills
FEM simulation, pad/pad over active structure design, Smart Power process knowledge, Excel, office suite
Technologies
FEM tools
Responsibilities
Develop new pad/pad over active structures, Coordinate CPI validation activities, Perform thermo-mechanical simulations
Seniority
Mid-level, hands-on IC
