Packaging SIPI Engineer, Sr. Staff
Core
Lead signal and power integrity engineering for automotive IC packages, optimizing design and system simulation to meet constraints before tape-out.
Role type
Sr. Staff IC Packaging SI/PI Engineer (Leadership)
Builds
Automotive chip packages and system-level interfaces
Domain
Semiconductor packaging, Signal Integrity, Power Integrity, Automotive
Required skills
System/Package Design, Time domain analysis, Frequency domain analysis, SerDes interfaces, DDR interfaces, Design guidelines, System simulation, Design automation, Technical documentation, Leadership
Preferred skills
Automotive package design, AI for efficiency, SerDes specs (PCIe, USB, UFS), Matlab, C/C++ or scripting, Electromagnetics, Transmission line theory, Field solvers (HFSS, Q3D, Sentinel-PSI, Clarity), Simulation tools (ADS, Hspice), Layout tools (Cadence, Mentor)
Technologies
HFSS, Q3D, Sentinel-PSI, Clarity, ADS, Hspice, Cadence Allegro, Mentor Xpedition, Matlab, Python, Perl, C++, C
Responsibilities
Perform package extraction for time and frequency domain analysis, Perform system-level analysis for DDR, SerDes & Mixed signal interfaces, Provide design guidelines for Package design, Perform system simulation and provide feedback for design optimization, Develop design & analysis flow and automate the process, Create technical documentation and presentations
Seniority
Sr. Staff, Leadership
