Senior/Principal Optical Packaging Engineer
Core
Translate system-level optical, electrical, thermal, and mechanical requirements into package architectures and qualification strategies for next-generation optical and advanced packaging technologies.
Role type
Senior/Principal Optical Packaging Engineer
Builds
Scalable optical and advanced packaging technologies for AI infrastructure and high-performance computing.
Domain
Semiconductor packaging, photonics, AI infrastructure, high-performance computing
Deliverable
production ML models | product features | infrastructure
Required skills
advanced semiconductor packaging, optical/photonics packaging, heterogeneous integration, 2.5D/3D integration, interposers/RDL, fine-pitch interconnects, die attach/bonding, underfill, moulding, adhesives, thermal management, optical coupling and alignment, electrical interconnects, package reliability, DFM, manufacturing readiness, co-packaged optics (CPO), silicon photonics, optical engines, lasers, high-speed optical interconnects, fibre attach, active/passive optical alignment, lens integration, optical link-budget evaluation
Preferred skills
experience with foundries, OSATs, optical component/module suppliers, equipment suppliers, or material suppliers
Technologies
CoWoS, SoIC, EMIB, fan-out packaging, chiplet integration, wafer-level packaging, interposer-based heterogeneous integration
Responsibilities
Shape next-generation optical and advanced packaging technologies; influence package architectures integrating photonic devices, electronic ICs, ASICs/chiplets, interposers, optical interfaces, and thermal solutions; help move technologies across the complete lifecycle from architecture and prototype development through supplier qualification and production readiness; translate advanced research and packaging innovation into scalable technologies with real-world product impact.
Seniority
Senior/Principal, hands-on IC with strategic influence
