Senior ASIC Package Design Engineer
Core
Designing advanced ASIC package architecture for high-performance mixed-signal and digital SoCs, focusing on flip-chip BGA and multi-chip module solutions for high-power satellites.
Role type
Senior IC ASIC Package Design Engineer
Builds
High-pin-count, high-speed, power-dense ASIC packages for satellite platforms
Domain
Aerospace / Semiconductor Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> production ML models (Incorrect mapping in thought, correcting to: production ML models is wrong, this is physical/infrastructure. Let's use 'product features' or 'infrastructure'. Actually, the instruction says 'one of: ...'. This role builds physical packages. 'infrastructure' or 'product features' fits best. Let's look at the list again: 'production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work'. None fit perfectly for 'physical hardware design'. 'infrastructure' is often used for backend systems. 'product features' is for software. 'physical/clinical work' is for doctors/engineers doing hands-on. This is design. I will select 'infrastructure' as it relates to the physical build of the system, or 'product features' if considering the package as a feature. However, 'physical/clinical work' is the closest to hardware. Let's re-read the list. It seems tailored for specific domains. I will choose 'infrastructure' as the package is part of the system infrastructure, or 'product features'. Actually, looking at the other examples, 'physical/clinical work' is for roles like 'nurse' or 'clinical engineer'. This is a design role. I will use 'infrastructure' as the package enables the system. Wait, the prompt says 'Extract only facts...'. The role builds the package. I will use 'infrastructure' as a proxy for hardware systems if 'physical' is too clinical. Actually, let's look at the 'Deliverable' options again. 'product features' is the most generic for engineering deliverables. But 'infrastructure' fits the 'builds' aspect. Let's go with 'infrastructure' as the package is the physical infrastructure of the chip.
Required skills
FC-BGA package design, substrate stack-up definition, power delivery network (PDN) design, signal integrity (SI) and power integrity (PI) analysis, thermal architecture design, OSAT and substrate vendor management, high-speed SerDes interface design, impedance control planning, via strategy definition, escape routing design
Preferred skills
Multi-chip module (MCM) design, heterogeneous integration (chiplets, interposers), high-speed digital or mixed-signal SoC background, aerospace or high-reliability electronics experience
Technologies
SIWave, HFSS, ADS
Responsibilities
Define ASIC package architecture including substrate stack-up, ball-map, and mechanical constraints; Lead package-level trade studies for cost, performance, PI, SI, thermal, and reliability; Establish package design standards and methodologies; Drive detailed design of FC-BGA packages for high-pin-count ASICs; Define substrate stack-ups, via strategies, and reference plane planning; Partner with silicon and RF teams to co-optimize die floorplans; Support package-level SI/PI strategy and decoupling; Lead thermal architecture including lid selection and heat-spreaders; Manage relationships with external packaging vendors and OSATs; Drive material selection and assembly process optimization
Seniority
Senior, hands-on IC
