Principal IC Packaging Engineer
Core
Lead the development of advanced integrated circuit (IC) packaging technologies for Data Center AI, Power Management, and emerging markets, driving innovation from concept to high-volume manufacturing.
Role type
Principal IC Packaging Engineer
Builds
Advanced packaging solutions including wafer bonding, RDL, 3D, 2.5D, and System in Package (SiP) for high-performance computing products.
Domain
Semiconductor industry, IC Packaging
Required skills
Advanced packaging methods (wafer bonding, RDL, flip chip, wire bond, SiP), package architecture, high-density interconnect design, reliability standards, failure analysis, OSAT management, cross-functional team leadership, project management
Preferred skills
2.5D/3D high-density die-to-die interconnects, fan-out bridges, FCBGA, MCM, substrate manufacturing processes, data center/rack design collaboration
Technologies
RDL, wafer bonding, flip chip, wire bond, SiP, FCBGA, MCM, 2.5D, 3D packaging
Responsibilities
Provide leadership for advanced packaging technology development, oversee new product introductions to high-volume manufacturing, manage relationships with foundries and OSATs, resolve complex technical issues in development and manufacturing, lead cross-functional teams
Seniority
Principal, hands-on IC
