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Hardware & Physical Engineering
› Analog IC Design
Analog IC Design
2,194 open positions
Sr. Principal Engineer: Silicon Photonics-Hybrid Integration
Lumentum
USA - CA - San Jose (Ridder)
$150k
1mo
Lead the development of high-volume process flows for hybrid integration of unique materials to enhance Silicon photonics performance for cloud and network applications.
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Staff Mixed-Signal Design Engineer
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Analog Devices
Dublin, County Dublin, Ireland
1mo
Provide technical leadership in the design and development of sophisticated mixed-signal integrated circuits (ICs) including power management ICs, ADCs, DACs, PLLs, and other mixed-signal blocks.
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Senior Analog Design Engineer
Intel
US, California, Santa Clara
$142k
1mo
Design and validate high-speed analog and mixed-signal integrated circuits for silicon photonics optical interconnect products.
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Senior Engineer, Analog Design Engineering
Analogdevices
Taiwan, Taipei, Songgao
1mo
Designing transistor-level analog/mixed-signal circuits and validating performance in the lab for consumer IC products.
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Analog Circuit Design Engineer
Intel
India, Bangalore
1mo
Lead the design and development of advanced analog and mixed-signal circuits for high-speed chip-to-chip and package-to-package connectivity.
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Senior Principal Mixed-Signal IC Design Engineer
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Analog Devices
Toronto, Ontario, Canada
$157k–$227k
1mo
Leading the development of high-speed data converters (RF DACs, ADCs, SerDes PHYs) in FinFET processes for SoC integration.
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SerDes Micro Architect
Apple
Austin, United States of America
1mo
Define micro architecture for next-generation SERDES IPs used in Apple silicon for iPhone, iPad, Mac, and Apple Watch.
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Principal Advanced Packaging Design Engineer
Marvell
Burlington, VT
$168k–$249k
1mo
Lead package design and technology development for next-generation HPC, AI, and networking solutions, focusing on signal, power, thermal, and mechanical integrity of multi-chip configurations.
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Senior Analog IC Design Engineer
ON Semiconductor
Marin-Epagnier, Neuchatel, Switzerland
1mo
Design and develop precision analog/mixed-signal IP components for automotive, industrial, and medical products.
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Senior Staff ESD Engineer
Renesas-Electronics
Chandler, Arizona, us
1mo
Design and optimize ESD protection structures and perform characterization for High Voltage BCD, analog, power, and mixed-signal ICs to ensure robust protection in automotive and industrial applications.
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Staff Analog Engineer
Renesas-Electronics
Kodaira, jp
1mo
Design and verify functional high-side switch analog product lines including LDOs, Bandgaps, Charge pumps, Predrivers, Power FETs, and ADCs for new product development.
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Team leader - RF/Analog Analysis & Characterization
Renesas-Electronics
Athens, gr
1mo
Lead a team in Pre/Post silicon activities for RF, Analog, and PHY system circuit building blocks to meet functional and performance specifications.
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CDI - Senior SoC Digital Design Engineer – Digital Mixed-Signal IC F/H
STMicroelectronics
Grenoble, France
1mo
Lead the digital design team to define architecture, specifications, and drive the execution of digital mixed-signal IC projects.
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CDD - Ingénieur conception analogique - F/H
STMicroelectronics
Crolles, France
1mo
Design and update test circuits for image sensor pixels and SPADs to support R&D characterization.
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Principal Engineer - HIG HBM - ARCHITECTURE
Micron
Richardson, TX
1mo
Define and drive the architecture of high-speed analog and mixed-signal IO subsystems for next-generation High Bandwidth Memory (HBM) products used in AI and high-performance computing.
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Principal Foundry Interface Design Engineer, HBM
Micron
Folsom, CA, US
$150k
1mo
Serve as the primary technical interface between Micron design teams and foundry partners to translate advanced process capabilities into scalable, high-performance HBM DRAM architectures for AI/ML workloads.
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Senior Mixed-Signal Physical Design Engineer - Cork, Ireland
Qualcomm
Cork, Ireland
1mo
Leading and hands-on Analog Mixed-Signal Physical Design projects for next-generation SerDes, Sensors, and DDR IP in 3nm technologies and below for Snapdragon SoCs.
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ESD Design Expert
Nxp
Toulouse
1mo
Define and deploy advanced ESD protection solutions and strategies for automotive and industrial semiconductor products, ensuring robustness and First-Pass-Right development.
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Associate Analog Design Engineer
Analogdevices
US, AZ, Chandler, East Elliot
$68k
1mo
Design and development of analog and mixed-signal integrated circuits including sensor interfaces, data converters, and power distribution systems.
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Memory Design Engineer
Broadcom
IND-Bangalore Electronic City - S1
1mo
Design and development of Single/Multiport SRAM and Register file compilers across 28nm to 5FF technologies.
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Mixed Signal Design Engineer
Nxp
Tianjin (Teda)
1mo
Design, implement, and verify analog/mixed-signal IP blocks while defining architecture with digital and SOC teams.
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Senior Staff Analog Mixed Signal Design
Infineon
Bangalore BTP
1mo
Lead end-to-end development of analog and mixed-signal ICs for Power Management IC (PMIC) applications, from architecture definition through silicon validation and production release.
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CIFRE - Multiscale Electro-Thermal Modeling of Silicon Power Devices
STMicroelectronics
Rousset, France
1mo
Develop and validate a coupled electro-thermal simulation workflow to predict self-heating, current crowding, and Safe Operating Area (SOA) limits in silicon power MOSFETs for automotive applications.
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Package Development Engineer
ON Semiconductor
Scottsdale, AZ, United States
1mo
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration.
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ENGR STAFF, R&D ENGINEERING; DSGN (SIMULATION ENGINEER)
ON Semiconductor
Seremban, Negeri Sembilan, Malaysia
1mo
Develop and execute thermo-mechanical simulation methodologies for semiconductor packages and power modules to support new product development and design optimization.
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Senior Hardware Engineer-Interconnection
Microsoft
Taiwan, New Taipei City, New Taipei City
1mo
Develop detailed specifications and lead design reviews for high-speed interconnect solutions, ensuring co-design alignment across electrical, mechanical, and system disciplines for hyperscale and data center hardware.
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Senior Staff Analog Design Engineer
Renesas-Electronics
Chandler, Arizona, us
1mo
Provide technical leadership in the development of complex Power Management ICs (PMICs), guiding designs from concept through production.
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Principal Product Engineer – High-Speed IP SerDes
Cadence
GYEONGGI-DO (Seoul)
1mo
Principal Product Engineer leading post-sales technical support and product engineering for high-speed interface IP (SerDes), serving as the primary interface between customers and R&D.
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Senior PHY System Integration Engineer
NVIDIA
Israel, Yokneam
1mo
Lead integration of PHY system aspects and optical (CPO) electrical subsystems for high-performance optical switch development.
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Design Engineer
Silabs
Oslo
1mo
Architect, design, and verify analog and digital circuits for low-power IoT MCUs and wireless transceivers.
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Analog IC Design Engineer | BCP
Texas Instruments
Santa Clara, CA, United States
1mo
Lead analog IC design from definition to release for battery charging applications, ensuring technical objectives are met during silicon evaluation and production transfer.
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PCB Design Layout Engineer
NVIDIA
Israel, Yokneam
1mo
Perform PCB layout of high speed/high-density value-conscious PCBs for all NVIDIA business units, managing CAD layout from symbol creation to detailed component placement and constraints.
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CDI - Ingénieur Vérification Analogique / Mixed-Signal (AMS) - F/H
STMicroelectronics
Paris, France
1mo
Analog and Mixed-Signal verification engineer for complex integrated circuits (SOCs) in the Imaging division, focusing on optical sensors, laser drivers, and signal processing algorithms.
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Analog Design, Sr Architect - 18729
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Synopsys Inc
Markham, Ontario, Canada
2mo
Sr Architect leading the design and optimization of high-performance DDR and HBM PHY interfaces for Synopsys IP portfolio.
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Analog Design, Sr Staff Engineer
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Synopsys Inc
Porto Salvo, Lisbon, Portugal
2mo
Senior Analog Design Engineer leading the development of high-speed SerDes IP for Ethernet and PCIe standards in advanced FinFET/GAA process nodes.
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2027 PhD SerDes Optical Transceivers Silicon Design and Architecture Modeling Engineer Intern/Co-op
Advanced Micro Devices, Inc
San Jose, California; Santa Clara, California
2mo
PhD intern designing and modeling silicon architecture for high-speed SerDes optical transceivers.
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2027 PhD Analog/Mixed-Signal SerDes Design Intern/Co-op
Advanced Micro Devices, Inc
San Jose, California; Santa Clara, California
2mo
Design high-speed analog and mixed-signal circuit architectures for electrical and optical interconnects in advanced FinFET technologies.
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Principal Analog Mixed-Signal Design Engineer
Asteralabs
San Jose
$207k
2mo
Architect and design high-performance analog and mixed-signal circuits for SerDes, PHY, and high-speed I/O to enable rack-scale AI infrastructure.
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Principal Electrical Engineer
Renesas-Electronics
Chandler, Arizona, us
2mo
Lead ESD architecture development, IP design, and sign-off verification for advanced-node semiconductor products including FinFET technologies and high-speed interfaces.
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Master - Elektro- und Informationstechnik Analog Chipdesign
Aumovio
Regensburg, BY, de
2mo
Develop analog and mixed-signal integrated circuits for future mobility solutions, specifically for automotive applications.
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Sr Staff/Principal Laser Design Engineer
Lightmatter
Boston, MA
$212k
2mo
Design high-power laser epitaxial structures and devices (DFB, DBR, external-cavity) for AI data center photonics.
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Scientist - Package design engineer (all genders)
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Silicon Austria Labs (sal)
Villach, Carinthia, Austria
€65k
2mo
Research and development of advanced packaging platforms (2.5D and 3D) and design/fabrication of Si/RDL interposers for photonic-electronic integration.
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Process Integration Engineer (SM1)
Texas Instruments
Sherman, TX, United States
2mo
Drive integration and development for existing and future analog & CMOS nodes, interfacing with ATD, Process engineering, Parametric Test engineering, Product development, Quality and Manufacturing groups.
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Systems Engineering Intern - MS/PhD
Texas Instruments
Dallas, TX, United States
2mo
Develop advanced analog and digital chips and system products from concept to mass production, defining product roadmaps and negotiating trade-offs with stakeholders.
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ADCE Packaging Design Architect
Intel
US, Arizona, Phoenix
$221k–$312k
2mo
Drives end-to-end substrate design from concept through tape out, implementing physical layout and routing to optimize silicon-package-board performance.
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Analog Mixed-Signal IC Design Engineer (Custom Digital Timing Characterization and Liberty Modeling) – TeraWave
Blueorigin
San Diego, CA, US
$230k
2mo
Develop, simulate, characterize, and deliver Liberty (.lib) timing models for custom analog-digital interface circuits used in complex integrated circuits.
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RFIC Layout Engineer
Apple
Sunnyvale, United States of America
2mo
Create transistor-level layouts for RF and analog circuit blocks within wireless System-on-Chip (SoC) designs, ensuring high performance and energy efficiency.
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板级供电高级技术专家
Huawei
Dongguan, China
2mo
Lead board-level power integrity (PI) design for AI computing products, focusing on high-current, high-dynamic, compact, and low-power solutions to enhance power delivery performance and industry competitiveness.
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ASIC Engineer
Cisco
Thalwil, Switzerland
2mo
Designing analog circuits and components for ASICs deployed across Cisco platforms, focusing on power, performance, and area goals.
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Senior SerDes & Analog Layout Design Engineer
Microsoft
United States, North Carolina, Raleigh
2mo
Drive physical implementation of complex D2D SerDes and analog/mixed-signal IP in advanced process technologies, from floorplanning through tapeout, signoff, and integration.
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