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Hardware & Physical Engineering
› Analog IC Design
Analog IC Design
1,386 open positions
Staff Engineer, Analog Design
GlobalFoundries
Richardson
$88k–$88k
3mo
Design and develop high-performance analog and mixed-signal IP blocks including amplifiers, comparators, and data converters for silicon validation.
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Staff Semi Packaging Engineer
Analogdevices
US, CA, San Jose, Rio Robles
$130k–$130k
3mo
Drive IC package and power module development activities for new and existing analog products.
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Principal Analog Layout Engineer
ON Semiconductor
Bangalore, Karnataka, India
3mo
Designing high-quality layouts for complex Analog Mixed-Signal (AMS) IP blocks including voltage regulators, bandgap references, current sense amplifiers, and high-voltage switches for power management products.
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Senior Principal Interconnect Development Engineer
Hpe
San Jose, California, United States of America
$153k–$153k
3mo
Lead development of high-speed interconnect solutions (connectors and cables) for next-generation network switches and routers, focusing on frequency performance, signal integrity, and mechanical design.
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Work #LikeABosch Sensortec
Bosch-Group
Milano, Lombardia, it
3mo
Design, verify, and develop MEMS sensor solutions for consumer electronics, covering analog/digital IC design, system architecture, and sensor optimization.
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Signal Integrity Hardware Engineer, Everpure Platform
Purestorage
Office - Santa Clara
$175k–$175k
3mo
Lead high-speed signal integrity analysis, simulation, and measurement for enterprise SSD platforms, ensuring robust signal performance from architecture through production.
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信号完整性工程师
Sicarrier
China / Guangdong-Shenzhen,China / Shanghai-Shanghai,China / Beijing-Beijing
3mo
Conduct signal integrity simulation analysis and design for high-speed circuit boards, optimizing transmission lines, vias, and connectors to ensure product performance.
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信号完整性工程师
Sicarrier
China / Guangdong-Shenzhen,China / Shanghai-Shanghai,China / Beijing-Beijing
3mo
Conducting signal integrity (SI) and power integrity (PI) simulation, design, and testing for high-speed PCBs to ensure performance in new product development.
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New College Grad - Memory Design Engineer, HBM
Micron
Richardson, TX
3mo
Design, optimize, and validate memory, logic, and analog circuits for High Bandwidth Memory (HBM) products.
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Application Engineer - Physical Design (Back-End)
Cadence
PETAH TIKVA, IL
3mo
Provide expert-level technical pre-sale and post-sale support for Cadence customers in the Physical Design area.
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信号完整性工程师
Sicarrier
China / Guangdong-Shenzhen,China / Shanghai-Shanghai,China / Beijing-Beijing
3mo
Conduct signal integrity simulation analysis and design for high-speed circuit boards, optimizing transmission lines, vias, and connectors to ensure product performance.
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Test Applications Engineer
Texas Instruments
Mabalacat, Pampanga, Philippines
3mo
Application support and characterization for high-speed amplifiers, including design-in support, debugging, and reference design creation.
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器件设计工程师
Sicarrier
China / Guangdong-Shenzhen,China / Shanghai-Shanghai,China / Beijing-Beijing
3mo
Research and development of advanced components including MEMS, optoelectronic, and precision sensing devices, covering CMOS-MEMS integration, flexible devices, and precision packaging.
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ASIC设计工程师
Sicarrier
China / Guangdong-Shenzhen
3mo
Design high-speed communication chips including analog circuits (BGR, LDO, ADC, DAC, OPA, PLL, AFE, CDR) and digital logic (RTL design, verification, backend) for chip applications.
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Senior Quantum Package & Motherboard Engineer
Microsoft
United States, Washington, Redmond
3mo
Develop and maintain robust Package & Motherboard design processes for quantum devices, including PCB design, signal/power integrity simulation, and supply chain management for cryogenic solutions.
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Staff Analog Engineer
Renesas-Electronics
Catania, it
$50k–$50k
3mo
Design and development of smart power stages and power management integrated circuits (ICs), including low-power precision analog and mixed-signal circuits.
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Sr Analog Design Engineer
Renesas-Electronics
Catania, it
$39k–$39k
3mo
Design, verification, and validation of power management ICs for high-performance computing platforms.
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HPC High-Speed SerDes Interface Evaluation Leader
Renesas-Electronics
Kodaira, jp
3mo
Leading technical evaluation of high-speed SerDes interfaces (PCIe, CSI, DP, UCIe) for automotive SoCs to ensure signal quality and reliability.
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New College Grad - Design Engineer, Circuit Design
Micron
San Jose, CA
$83k–$83k
3mo
Design and verify NAND Flash circuits and systems spanning analog and digital domains to ensure robust, manufacturable, high-performance memory products.
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Server ODM Field Applications Engineer
Micron
Taipei - MTT office, Taiwan
3mo
Field Applications Engineer supporting memory and storage solutions by strengthening technical partnerships, solving customer issues, and providing memory architecture advice.
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Memory Circuit Design Engineer
Intel
US, Oregon, Hillsboro
$122k–$122k
3mo
Design and develop high-performance, high-density, low-power embedded memory circuits and IP for Intel's advanced CMOS process technologies.
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New College Grad - Design Engineer, Circuit Design
Micron
San Jose, California, United States of America
$83k–$83k
3mo
Design and verify NAND Flash circuits and systems, spanning analog and digital domains, to ensure robust, manufacturable, and high-performance memory products.
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Optical 3D Packaging Technologist
MediaTek
San Jose, CA
3mo
Develop and validate optical interconnect packaging solutions (CPO, FAU, OE) for 2.5D/3D/3.5D architectures supporting AI and Datacenter/HPC product families.
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Principal AMS Verification Engineer
Micron
Hyderabad - Phoenix Aquila, India
3mo
Verification of analog and mixed-signal circuits, including full-chip simulation environments and device-level electrical rule checks for memory and storage solutions.
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Senior/Staff Product Development
Micron
Hyderabad - Phoenix Aquila, India
3mo
Develop test flows and strategies for 3D NAND memory test chips, validating test modes via simulation and post-silicon analysis to ensure product quality and reliability.
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Senior Analog Circuit Design Engineer
MediaTek
Austin, TX
3mo
Design analog and mixed-signal IP blocks for mobile System-on-Chips (SoCs), focusing on power-efficient solutions for smartphones, smart homes, and AI PCs.
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IC Layout Engineering Intern m/f/d
Texas Instruments
Freising, Bayern, Germany
3mo
Physical layout and verification of high-performance analog and mixed signal circuits in BiCMOS technologies for energy transformation systems.
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
Cisco
Remote
$184k–$184k
3mo
Lead signal and power integrity (SI/PI) design and verification for next-generation 2.5D/3D ASIC packaging deployed in high-performance switching, routing, and wireless platforms.
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Senior Thermal Engineering Technical Leader
Cisco
San Jose, California, US
$191k–$191k
3mo
Design and develop thermal solutions (air cooled or liquid cooled) for high-power ASICs and high-density optical transceivers in Cisco's core Switching, Routing, and Wireless products.
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Photonic Design Engineer
PsiQuantum
Palo Alto, California, United States
3mo
Design, validate, and analyze silicon photonic integrated circuits (PICs) and photodetectors for million-qubit, fault-tolerant quantum computers.
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Analog and Mixed-Signal IC Design Engineer Intern
Neuralink
South San Francisco - SSF
$73k–$73k
3mo
Designing and implementing analog and mixed-signal chip architectures for high-bandwidth brain-machine interface applications.
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Analog IC Design and Verification Engineer
Neuralink
Fremont - Campus
$125k–$125k
3mo
Designing analog and mixed-signal chip architecture and silicon implementation for high-bandwidth brain-machine interface SoCs.
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HBM 3D Power Delivery Network (PDN) Engineer
Micron
Richardson, TX, US
$146k–$146k
3mo
Design, analyze, and optimize power delivery networks (PDN) for next-generation HBM products to ensure power integrity, reliability, and manufacturability.
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Engineer- DRAM, Advanced DRAM and EM Device/Cell Technology
Micron
Boise, Idaho, United States of America
3mo
Define and validate future DRAM device and cell technologies, characterizing memory arrays and analyzing electrical behavior to shape the electrical foundation of next-generation products.
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Engineer-std cell layout
Micron
Hyderabad, Telangana, India
3mo
Design and maintain standard cell layouts for new DRAM products on emerging technologies, leading projects from specification to PPA-qualified library release.
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Engineer- DRAM, Advanced DRAM and EM Device/Cell Technology
Micron
Boise, ID - Main Site
3mo
Define and validate future DRAM device and cell technologies by characterizing memory arrays, analyzing electrical behavior, and developing physical/electrical models to optimize performance, yield, and reliability.
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HBM 3D Power Delivery Network (PDN) Engineer
Micron
Richardson, Texas, United States of America
$146k–$146k
3mo
Design, analyze, and optimize power delivery networks (PDN) for next-generation HBM products, ensuring robust power integrity and reliability across die-package-system interactions.
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<Data center>TOP Designer & FE Integrator
MediaTek
HsinChu
3mo
Designing top-level integrated circuits for testing, including uArch, DFT, and PAD top, and integrating front-end sensors and IOs for simulation and post-Si validation.
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Engineer-std cell layout
Micron
Hyderabad - Phoenix Aquila, India
3mo
Designing and maintaining standard cell layouts for new DRAM products on emerging technologies.
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HIG-HBM ENGINEERING MANAGER - LAYOUT
Micron
Jalisco, Mexico
3mo
Lead a distributed team developing complex analog, mixed-signal, and custom layouts for next-generation AI and high-performance computing solutions.
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Senior IC Design Engineer
Flir
US - Chestnut Ridge, NY
$142k–$142k
3mo
Design custom integrated circuits using Silicon Germanium BiCMOS technologies for Teledyne LeCroy's oscilloscopes and probes, covering amplification, signal conditioning, sampling, clocking, and triggering.
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PCB Layout Engineer (m/f/d)
Siemens-Eda
Bruckmuehl, DEU, Germany
$61k–$97k
3mo
Designing PCB layouts, ensuring power and signal integrity, and managing thermal performance for high-speed electronic systems.
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Analog/Mixed-Signal Layout Engineer
MediaTek
Woburn, MA
3mo
Develop high-quality layouts for advanced data converters, power management circuits, and mixed-signal IP from initial planning through final sign-off.
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Senior Staff Design Engineer – Analog/Mixed-Signal/RF
MediaTek
Woburn, MA
3mo
Design advanced analog, mixed-signal, and RF circuits for state-of-the-art wireless and connectivity applications, taking designs from concept through silicon validation.
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Senior Engineer, IPDev Layout
Micron
Hyderabad - Phoenix Aquila, India
3mo
Design and development of critical analog, mixed-signal, custom digital blocks, and full chip level integration for advanced DRAM chips.
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Lead Application Engineer
Cadence
CORK 01
3mo
Lead technical solutions for customers on schematic capture and PCB front-end flows, acting as the primary interface for design challenges and methodology guidance.
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SRAM Process Development Engineer
Texas Instruments
Dallas, TX, United States
3mo
Developing high-density, production-worthy SRAM memory technology through device definition, process integration, and yield qualification.
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Staff Engineer, Scribe Layout Design
Micron
Hyderabad - Phoenix Aquila, India
3mo
Designing test structures and layout for advanced memory cell/pitch development in R&D, supporting process integration and manufacturing.
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Optical Systems Engineer Lead
Lumilens
San Jose
3mo
Lead the design, modeling, and optimization of high-speed optical-transceiver-based interconnect solutions for data center and AI applications.
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Power Integrity Engineer-Silicon
Lumilens
San Jose
3mo
Architecting and validating power delivery networks (PDNs) for 2.5D/3D heterogeneous integration of electrical ICs, photonic ICs, and chiplets to support extreme power densities in AI supercomputing.
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