IC Package Design Engineer
Core
Lead advanced package architecture and physical design for semiconductor packages (SoC, memory, RF, cellular) across Apple products.
Role type
Senior IC Package Design Engineer
Builds
Advanced semiconductor packages and SiPs for iPhone, iPad, Mac, Apple Watch, and Apple TV
Domain
Semiconductor manufacturing / Electronic packaging
Required skills
IC package physical design, parasitic extraction (RLGC), S-parameter modeling, Signal/Power Integrity (SI/PI) analysis, cross-functional system co-optimization, CAD tool evaluation, automated design flows
Preferred skills
Cadence Allegro or Mentor Xpedition, SiP/PoP/wirebond verification (Calibre, CAM350), high-speed interface layout (DDR, PCIe), HFSS or PowerSI simulation, substrate manufacturing processes, Unix/Linux scripting (Python, Perl, TCL)
Technologies
Cadence Allegro, Mentor Xpedition, Calibre, CAM350, HFSS, PowerSI, Python, Perl, TCL
Responsibilities
Perform physical layout of package substrates for diverse silicon; Execute parasitic extraction and S-parameter modeling; Lead cross-functional collaboration on package feasibility; Drive package design methodology improvements
Seniority
Senior, hands-on IC
