ASIC Package Design Project Manager
Core
Lead a team of engineers designing complex flip-chip-BGA packages for high-performance ASICs serving AI, networking, HPC, and 5G base stations.
Role type
Senior IC Package Design Project Manager
Builds
High-performance ASIC packages with 448G+ SerDes, 5G RF/Microwave ADC/DAC, HBM, and DDR5
Domain
Semiconductor packaging, AI, Networking, HPC, 5G
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Project management, package-level signal integrity, power integrity, substrate/package design flows, design data management, DFx trade-offs, layout, SI/PI extraction and simulation, mechanical & thermal modeling, automation code development
Preferred skills
Managing package design projects, new business quotes
Technologies
flip-chip-BGA, SerDes, HBM, DDR5, .mcm, POD, Lid, Substrate
Responsibilities
Create and track project plans for 20+ concurrent designs, improve scheduling methodologies, organize team and customer activities, communicate plans and risks, create technical methodologies for package design, steer package technology and design rules
Seniority
Senior, hands-on IC