Engineer- Multi-Physics Sign-off (Timing, PDN & Thermal)
Core
Develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems, covering timing, power, IR/EM, ESD, thermal, and multiphysics analysis.
Role type
Senior IC CAD & Methodology Engineer (3DIC/2.5D)
Builds
Robust, scalable, production-ready flows for 3DIC and 2.5D designs spanning floor planning through tapeout
Domain
Semiconductor / Advanced Packaging / Multi-Physics
Required skills
VLSI knowledge, 3DIC/2.5D design implementation, cross-die timing closure, power/IR/EM signoff, thermal analysis, CFD/FEM modeling, automation/scripting, EDA tool qualification
Preferred skills
Chiplet-based design experience, TSV/micro-bump/interposer knowledge, Cadence Integrity 3D-IC, Synopsys 3DIC Compiler, Cadence Celsius, Ansys Icepak, Ansys RHSC-ET (via careerplan.io/jobs/101024460816-engineer-multi-physics-sign-off-timing-pdn-thermal-at-arm)
Technologies
Cadence Integrity 3D-IC, Synopsys 3DIC Compiler, Cadence Celsius, Ansys Icepak, Ansys RHSC-ET
Responsibilities
Develop and maintain CAD flows for 3DIC/2.5D designs; Enable end-to-end implementation and signoff methodologies; Support die-to-die connectivity and cross-die constraint management; Develop STA methodologies for multi-die designs; Enable power analysis, IR drop, and EM signoff flows; Develop thermal analysis methodologies using CFD/FEM; Build and maintain automation scripts to improve flow robustness; Collaborate with EDA vendors to evaluate new tools and features
Seniority
Senior, hands-on IC
