Principal Signal Integrity Engineer, Pathfinding
Core
Principal Signal Integrity Engineer developing energy-efficient bandwidth solutions for high-speed memory and die-to-die interfaces via original analysis, modeling, and simulation.
Role type
Principal Signal Integrity Engineer (Pathfinding/Advanced Development)
Builds
Forward-looking interconnect models, substrate/packaging evaluations, design rules, and link budgets for high-speed memory and die-to-die interfaces.
Domain
Semiconductor / High-Speed Interface / Signal Integrity
Required skills
Electromagnetic and transmission line theory, Time- and frequency-domain simulation (ADS, HSPICE, SPECTRE), Electromagnetic field solvers (Q3D, SIWAVE, HFSS), Hardware measurement (oscilloscopes, TDR, VNA), Cross-disciplinary collaboration, Technical documentation
Preferred skills
Memory I/O architectures, Advanced packaging (2.5D/3D, embedded die, high-density organic), Post-silicon characterization, Optical link modeling, AI-based workflow optimization
Technologies
ADS, HSPICE, SPECTRE, Q3D, SIWAVE, HFSS, Oscilloscopes, TDR, VNA
Responsibilities
Generate and validate interconnect models for packages and substrates; Lead SI assessment of next-generation substrate and packaging technologies; Drive SI analysis and I/O + channel co-optimization during feasibility studies; Develop progressive package and system-level design rules; Define forward-looking link budgets and sim-to-silicon correlation methodologies; Collaborate across Signal Integrity, Circuit, Chip Design, Packaging R&D, and System Integration.
Seniority
Principal, hands-on IC with strategic ownership
