Senior Packaging Technical Engineer - Hardware
Core
Define and implement silicon pad rings, substrate interconnect schemes, and lead package layout design for advanced GPU packages.
Role type
Senior IC packaging technical engineer (hardware)
Builds
Robust, world-class electrical packages for GPUs
Domain
Semiconductor / Hardware / Packaging
Required skills
Chip pad ring definition, substrate interconnect design, package layout design, chip floor planning, transmission line theory, power delivery, signal integrity
Preferred skills
Board/system design, Perl/Python/Tcl scripting, Cadence Skill, Excel
Technologies
Cadence Skill, Perl, Python, Tcl, Excel
Responsibilities
Define and implement chip pad rings, define substrate interconnect schemes, lead package layout design process, work with large cross-functional teams (Circuit, Signal Integrity, RTL, Place and Route)
Seniority
Senior, hands-on IC
