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Hardware & Physical Engineering
› Analog IC Design
Analog IC Design
2,192 open positions
2026 Field Applications Program
Texas Instruments
Taiwan
1y
12-month rotational program training rising Field Applications Engineers (FAEs) to solve customer design challenges and maximize revenue through systems-level solutions.
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MEMS - Analog FE Design
STMicroelectronics
Cornaredo, Italy
€42k
1y
Design analog front-end circuits for inertial MEMS solutions, focusing on architectural study, transistor-level design, simulation, and verification.
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Engineer / Staff Engineer - Sensor Circuit Design for Advanced Technology Node
MediaTek
Singapore
1y
Designing complex circuit blocks and standard cell libraries for leading-edge process nodes (planar, FinFET, nanosheet) and developing advanced library generation methodologies.
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Senior Package Layout Engineer
NVIDIA
Taiwan, Hsinchu
1y
Designing high-speed interconnect systems and IC substrates for Supercomputers and Datacenters.
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Sr. Layout Engineer
Monolithicpower
Taipei - Taiwan
1y
Developing Mixed-Signal and Analog Integrated Circuits through layout design, device placement, and tapeout execution.
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Principal High Speed Clocking Design Engineer
Monolithicpower
Chengdu - China
1y
Lead high-speed analog/mixed-signal circuit design for memory product IPs (DDR, LPDDR), focusing on critical clocking blocks and data path specifications.
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Layout Engineer (New Grad)
Monolithicpower
Taipei - Taiwan
1y
Develop Mixed-Signal and Analog Integrated Circuits by performing device placement, block implementation, and tapeout.
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Analog IC Design Lead (OLED Driver)
Monolithicpower
1y
Lead IC design for OLED driver circuits, managing the full flow from specification and block partitioning to transistor-level design, layout supervision, and silicon validation.
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Senior/Staff Analog Designer (Digital Isolator)
Monolithicpower
1y
Design and develop high-performance analog circuits, specifically digital isolators, for various applications.
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Package and Chip thermal/stress simulation engineer
MediaTek
HsinChu
1y
Performing thermal and stress simulation analysis for IC packages, boards, and system-level designs to ensure reliability under various conditions.
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Principal package developing engineer
Monolithicpower
Chengdu - China
1y
Developing new semiconductor package types, structures, and materials to meet process, reliability, and cost requirements for power delivery systems.
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Application Engineer
Monolithicpower
Chengdu - China
1y
Support new product application qualification, provide technical support for customers, and manage product technical documentation.
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Senior High Speed IC Product Engineer
Monolithicpower
Chengdu - China
1y
Develop high-speed mixed-signal ICs from initial specification to mass production, focusing on test solutions, characterization, and yield enhancement.
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2026校招-Analog FAE/现场技术应用工程师轮岗项目-模拟方向
Texas Instruments
Shenzhen, Guangdong, China
1y
12-month rotational program for new FAEs to learn customer-facing technical solutions, sales processes, and systems-level design support across Field Sales, Mass Market, and Business Unit tracks.
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SI/PI Senior Engineer
MediaTek
HsinChu
1y
Senior SI/PI engineer responsible for signal integrity and power integrity design of chip, package, and PCB development for consumer, automotive, and enterprise HPC products.
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Sr. Design Engineer
Monolithicpower
Durham, NC
1y
Designing analog and mixed-signal ICs for automotive power management products using sub-micron BiCMOS/DMOS technologies.
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Advanced Packaging Technologist
MediaTek
San Jose, CA
1y
Developing innovative 2.5D/3D advanced packaging solutions for automotive, datacenter/HPC, and computing applications.
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Analog Design Engineer
MediaTek
Bangalore
1y
Design and verify high-speed analog and mixed-signal blocks for SerDes architectures.
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<Data center>Serdes system architecture research and development engineer
MediaTek
HsinChu
1y
Developing high-speed SerDes system technology (200Gbps+) including electrical and optical communications, defining system specifications, and establishing simulation models.
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RF Design Engineer
GlobalFoundries
IND - Karnataka - Bengaluru - North
1y
Design, simulation, and verification of RF circuit design blocks (LNA, PA, RF Switches, SPXTs) for silicon bring-up and characterization in advanced technologies.
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Analog Design Engineer, Staff
d-Matrix
Santa Clara
1y
Designing state-of-the-art in-memory-compute engines for AI accelerators and die-to-die serial interfaces for scale-out systems.
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Experienced ESD Engineer (m/f/d)
Apple
Munich, Germany
1y
Define ESD methodology and design protection circuits to ensure silicon meets Apple's ESD specifications and manufacturing requirements.
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Analog/Mixed-Signal IC Design Engineer
Apple
San Diego, United States of America
1y
Lead the architecture and implementation of state-of-the-art analog/mixed-signal circuits, specifically data converters, from concept to high-volume production.
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Silicon Validation Engineer
Apple
San Diego, United States of America
1y
Lab characterization and validation of analog & mixed signal embedded circuits, specifically high-speed SerDes blocks, for mobile SoCs.
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Senior Package Design Engineer
MediaTek
HsinChu
1y
Design and planning of various products, specifically focusing on BGA substrate layout and advanced package technology development.
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Digital IC Design Engineering Intern
Texas Instruments
Shanghai, Shanghai, China
1y
Architect new TI products by defining, designing, modeling, implementing, and documenting analog, digital, and RF integrated circuits (ICs) across domains like audio, imaging, automotive, and power supply.
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Analog IC Design Engineering Intern
Texas Instruments
Shanghai, Shanghai, China
1y
Architect new TI products by defining, designing, modeling, implementing, and documenting analog, digital, and RF integrated circuits (ICs) across domains like audio, imaging, automotive, and power supply.
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Lead Analog Design Engineer
Texas Instruments
Bengaluru, Karnataka, India
1y
Lead the design, development, and verification of analog and mixed-signal circuits for embedded Flash Memory IPs, including charge pumps, voltage regulators, and sense amplifiers.
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Senior substrate layout engineer
MediaTek
HsinChu
1y
Designing advanced package BGA substrates and 2.5D IC routing (RDL & Substrate) for CoWoS and EMIB technologies.
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Electrical Engineer/FPGA Designer
Lumentum
Canada - Ottawa (Bill Leathem)
1y
Design, develop, and test FPGA-based systems and electrical circuits for advanced optical metrology sensors.
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Embedded Memory IP Designer
MediaTek
HsinChu
2y
Developing memory architectures and circuit implementation techniques for Mediatek products.
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Device Modeling Engineer
Semron
Dresden, DE (primary site) / Austin, TX
2y
Simulating physics for custom CapRAM devices to create models for analog circuit simulations.
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Camera Image Sensor Digital Design Engineer Lead
Apple
Cupertino, United States of America
2y
Lead the specification and verification of digital signal processing and interfaces for next-generation CMOS image sensor ASICs.
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Principal Design Engineer
Cadence
BANGALORE
2y
Lead major blocks of Memory PHY layout design and perform hands-on design of critical analog and high-speed layout blocks for FinFET technology.
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Design engineering Architect
Cadence
HYDERABAD
2y
Design, simulate, and verify custom memory design blocks for memory IP, including circuit design, characterization, and silicon bring-up.
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SOC On-Die Sensor Tech & Correlation Engineer
MediaTek
HsinChu
2y
Perform pre-silicon and post-silicon correlation and modeling for adaptive voltage scaling and on-die sensors; develop and improve post-silicon testing methodologies for these areas.
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Design Engineer II
Cadence
BANGALORE
2y
Post-Silicon Physical Layer Electrical Validation for high-speed SERDES protocols.
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Lead Design Engineer
Cadence
HYDERABAD 04
2y
Develop and integrate foundry rule decks and technology files to support Process Design Kits (PDKs), ensuring physical verification and automation of design flows.
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<Data center>Communication Algorithm Engineer/senior Engineer/Technical Manager
MediaTek
HsinChu
2y
Designing communication algorithms, PHY architecture, and digital signal processing for high-speed interfaces and transceivers.
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PMIC Digital IC Design Engineer
MediaTek
HsinChu
2y
Designing power management integrated circuit (PMIC) architectures for smartphones and automotive applications, focusing on low-power techniques and mixed-signal digital IP.
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Senior Analog IC Design Engineer
Semron
Dresden, DE (primary site) / Austin, TX
2y
Design ultra-low power analog IC periphery blocks for in-memory computing products from system-level decisions to post-layout floor-planning.
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Principal Design Engineer
Cadence
BANGALORE
2y
Design major sub-systems of High-speed Memory PHYs including Tx, Rx, and Clocking.
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Analog/Mixed-Signal Modeling Methodology Development Engineer
MediaTek
HsinChu
3y
Establish, streamline, and enhance Analog/Mixed-Signal (AMS) Behavioral Modeling development methods, coding, validation processes, and integration flows to ensure high-quality silicon products.
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<Data center>Die-to-Die High Speed Analog Circuit and HBM/DDRPHY Design Engineer
MediaTek
HsinChu
6y
Design of high-speed analog PHY circuits for chip-to-chip interfaces (UCIe, Die-to-Die) and memory interfaces (HBM, DDR, LPDDR).
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Senior Staff Engineer Module Simulation and Methodology (f/m/div)
Infineon Technologies Austria AG
Villach
Develop and optimize simulation methodologies for semiconductor devices, circuits, and Intermediate Bus Converters, correlating results with hardware data to support failure analysis.
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PCB专家/工程师-创新业务
ByteDance
深圳
Design and implement PCB board-level interconnect solutions for mobile and wearable products, ensuring reliability, compatibility, and manufactability across high-speed, power, and multi-board scenarios.
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模拟IP K库工程师(芯片平台) - 芯片研发
ByteDance
北京
Deliver timing and power libraries (CCS/LVF/CMM/APL/Verilog) for analog/mixed-signal IPs including PLLs, LDOs, power switches, decaps, and high-speed interfaces (SerDes/UCIe) across the chip design flow.
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版图设计工程师(西安) - 芯片研发
ByteDance
西安
Layout design engineer for custom hardware optimization in cloud chips, collaborating with circuit designers to create reliable layouts for advanced semiconductor processes.
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Principal RF Photonics Engineer (d/m/f)
ams-OSRAM AG
Premstätten
Driving lab metrology and PCB design methodology for electro-optical data transmission using Photonic Integrated Circuits (PICs).
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光通信SerDes链路研发专家
ByteDance
杭州
Designing and simulating SerDes link architectures for optical communication systems to ensure high-speed data transmission performance and stability.
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