Advanced Packaging Technologist
Core
Developing innovative 2.5D/3D advanced packaging solutions for automotive, datacenter/HPC, and computing applications.
Role type
Senior technical leader in advanced packaging (2.5D/3D)
Builds
Advanced packaging solutions (CoWoS, EMIB, SoIC, HBM, FCBGA, HBPOP) for high-performance computing and automotive markets
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
2.5D/3D package integration, CoWoS, EMIB, SoIC, HBM, FCBGA, HBPOP, cross-functional collaboration, project leadership, supply chain management, manufacturability analysis, material selection, BOM coordination
Preferred skills
Strategic thinking, customer obsession, third-party relationship management
Technologies
CoWoS, EMIB, SoIC, HBM, FCBGA, HBPOP
Responsibilities
Collaborate with internal teams and external partners to develop packaging solutions from concept to mass production; Coordinate with design and assembly partners to select materials and BOM ensuring manufacturability; Lead projects across design, engineering, supply chain, and QA; Establish and maintain relationships with suppliers and customers; Monitor and report on project progress and manufacturing metrics
Seniority
Senior, hands-on IC