Principal package developing engineer
Core
Developing new semiconductor package types, structures, and materials to meet process, reliability, and cost requirements for power delivery systems.
Role type
Principal package developing engineer
Builds
Next-generation integrated power semiconductor packages and delivery architectures
Domain
Semiconductor industry, power electronics, packaging engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
new package introduction and development, package development principles, semiconductor supply chain knowledge, assembly subcontractor management, packaging material vendor management, cost analysis, package design rule maintenance, road map planning
Preferred skills
AutoCAD, Cadence
Responsibilities
Develop new package types and structures, survey new materials for process and reliability requirements, collect packaging requirements from technical and marketing teams, work with assembly houses and vendors to qualify new materials and packages, provide technical support for package definition and selection, maintain package design rules and update road maps
Seniority
Principal, hands-on IC
