PCB专家/工程师-创新业务
Core
Design and implement PCB board-level interconnect solutions for mobile and wearable products, ensuring reliability, compatibility, and manufactability across high-speed, power, and multi-board scenarios.
Role type
Senior IC PCB Interconnect Engineer (High-Speed/RF)
Builds
High-performance PCBs for mobile phones and wearables
Domain
Consumer Electronics / High-Speed Digital & RF
Required skills
High-speed signal integrity (SI) analysis, Power integrity (PI) analysis, Electromagnetic compatibility (EMC) optimization, DDR4/DDR5 design, PCIe/USB3.0/4.0/UWB/RF interconnect design, DFM/DFA compliance, FPC/Rigid-Flex board design, Altium Designer/Cadence Allegro/PADS proficiency, Component selection for connectors/transmission lines/shielding
Preferred skills
Experience with compact space optimization, thermal management in PCBs, cost reduction strategies, rapid prototyping
Technologies
Altium Designer, Cadence Allegro, PADS, DDR4, DDR5, PCIe, USB3.0, USB4.0, UWB, 2G/4G/5G, Wi-Fi, Bluetooth
Responsibilities
Analyze requirements and select components for interconnect solutions; Optimize layout and routing for SI/PI/EMC while meeting size/weight constraints; Collaborate with hardware, structural, and manufacturing teams to drive sampling, testing, and mass production; Conduct technical pre-research on industry trends to improve performance and reduce costs; Establish and optimize PCB design standards, review processes, and testing protocols.
Seniority
Senior, hands-on IC
