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Analog IC Design Engineering Intern

Shanghai, Shanghai, China💼 Internship🗓 2025-02-17 → 2026-07-22

Core

Architect new TI products by defining, designing, modeling, implementing, and documenting analog, digital, and RF integrated circuits (ICs) across domains like audio, imaging, automotive, and power supply.

Role type

Analog IC design engineering intern

Builds

Analog, digital, and RF integrated circuits (ICs) for TI products

Domain

Semiconductor / Analog IC Design

Deliverable

production ML models | product features

Required skills

Analog IC design, digital IC design, RF IC design, chip architecture trade-off analysis, IC layout supervision, prototype characterization, test specification development, behavioral modeling

Preferred skills

Stakeholder relationship building, verbal and written communication, rapid system/process ramp-up, analytical problem-solving, teamwork, initiative, time management

Technologies

None explicitly stated

Responsibilities

Partner with business and system engineering teams to develop design specifications; Provide high-level analysis on chip architecture trade-offs; Participate in design reviews and create documentation; Supervise IC layouts; Characterize prototypes and develop test specifications; Drive behavioral models

Seniority

Intern

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