CareerPlanGet AI match score →

Digital IC Design Engineering Intern

Shanghai, Shanghai, China💼 Internship🗓 2025-02-17 → 2026-07-22

Core

Architect new TI products by defining, designing, modeling, implementing, and documenting analog, digital, and RF integrated circuits (ICs) across domains like audio, imaging, automotive, and power supply.

Role type

Digital IC Design Engineering Intern

Builds

Analog, digital, and RF integrated circuits (ICs) for Texas Instruments products

Domain

Semiconductor / Integrated Circuit Design

Deliverable

production ML models | product features | infrastructure

Required skills

IC architecture definition, digital/analog/RF circuit design, behavioral modeling, design review participation, prototype characterization, test specification development, product documentation

Preferred skills

stakeholder relationship building, system ramp-up, analytical problem-solving, team collaboration, initiative, time management

Technologies

[Not explicitly stated in description]

Responsibilities

Partner with business and system engineering teams to develop design specifications; Provide high-level analysis on chip architecture trade-offs; Participate in design reviews and create documentation; Partner on IC layouts; Characterize prototypes and develop test specifications; Drive behavioral models

Seniority

Intern

Sourced via oracle_hcm · Listed on CareerPlan, which tracks 70,000+ jobs from 20+ sources.
Apply on Oraclecloud ↗