Senior substrate layout engineer
Core
Designing advanced package BGA substrates and 2.5D IC routing (RDL & Substrate) for CoWoS and EMIB technologies.
Role type
Senior substrate layout engineer
Builds
Advanced packaging substrates and 2.5D IC interconnects
Domain
Semiconductor packaging and advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
BGA substrate layout, 2.5D IC routing, DRC/LVL/LVS verification, EDA tool evaluation, package design methodology development
Technologies
CoWoS_S, CoWoS_L, CoWoS_R, EMIB, EDA tools
Responsibilities
Perform DRC, LVL, and LVS checks on BGA substrate layouts; Route RDL and substrate for 2.5D IC structures; Collaborate with package design engineers to meet design requirements; Develop new layout methodologies; Evaluate new layout and PV EDA tools
Seniority
Senior, hands-on IC
