Principal Foundry Interface Design Engineer, HBM
Core
Serve as the primary technical interface between Micron design teams and foundry partners to translate advanced process capabilities into scalable, high-performance HBM DRAM architectures for AI/ML workloads.
Role type
Principal Foundry Interface Design Engineer (HBM)
Builds
Next-generation HBM DRAM products and custom memory solutions
Domain
Semiconductor industry, High Bandwidth Memory (HBM), Advanced Packaging
Deliverable
production ML models | product features
Required skills
HSPICE simulation, Device characterization, PPA analysis, Parasitic extraction, Physical verification, Foundry roadmap influence, TSV technology knowledge, BEOL optimization, AI-enabled engineering workflows
Preferred skills
Experience with TSMC/Samsung/Intel/GlobalFoundries, Memory product expertise (DRAM/HBM/SRAM), Reliability modeling, PDK development, Node selection leadership
Technologies
HSPICE, TSV, BEOL, PDK, FinFET, AI tools
Responsibilities
Act as primary technical interface with foundry partners; Drive closure of design-process gaps; Perform HSPICE simulations and circuit analysis; Plan and implement technology evaluation test chips; Evaluate foundry PDKs and IP collateral; Identify and implement AI-enabled workflows for engineering productivity
Seniority
Principal, hands-on IC with strategic influence