Package Development Engineer
Core
Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration.
Role type
Senior IC package development engineer (embedded packaging)
Builds
Embedded package architectures with embedded passives, active devices, and HDI substrates
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> product features (embedded packages)
Required skills
embedded packaging architecture, substrate stack-up design, interconnect schemes, thermal solutions, process development (embedding, lamination, laser drilling, metallization), reliability qualification, root cause analysis, yield improvement, cross-functional leadership
Preferred skills
DOE, statistical analysis, process optimization, OSAT/vendor partnership management
Technologies
ACAD, 8D, SPC, DFMEA, DOE, JEDEC standards, IPC standards
Responsibilities
Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules; Lead process development for embedding, lamination, laser drilling, metallization, and assembly; Drive package qualification and reliability assessments; Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions; Conduct root cause analysis and implement yield, quality, and cost improvements; Lead cross-functional teams through concept, development, qualification, and production release
Seniority
Senior, hands-on IC