ENGR STAFF, R&D ENGINEERING; DSGN (SIMULATION ENGINEER)
Core
Develop and execute thermo-mechanical simulation methodologies for semiconductor packages and power modules to support new product development and design optimization.
Role type
Staff R&D Simulation Engineer (Thermo-Mechanical)
Builds
Simulation models for thermal performance, stress, warpage, and reliability analysis of electronic assemblies
Domain
Semiconductor manufacturing / Thermal management / Mechanical engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
FEA modeling, thermal analysis, mechanical stress analysis, failure analysis, simulation methodology development, cross-functional collaboration, technical reporting
Preferred skills
Semiconductor packaging knowledge, material characterization, correlation of simulation with experimental data, advanced packaging technology
Technologies
ANSYS Mechanical, ANSYS Icepak, Abaqus, COMSOL
Responsibilities
Perform thermo-mechanical simulations of semiconductor packages and power modules; Develop simulation models to evaluate thermal performance and reliability risks; Support package and material selection by assessing mechanical integrity; Conduct root-cause investigations and failure analysis; Collaborate with design, process, and manufacturing teams to optimize performance; Develop and improve simulation methodologies and correlation practices; Generate technical reports and provide design recommendations
Seniority
Staff, hands-on IC with strategic impact
