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Product & Design
› Semiconductor Product Engineering
Semiconductor Product Engineering
846 open positions
Director Field Applications Engineering
Infineon
Andover, MA
7d
Leading the Global Field Applications Engineering (FAE) team for IR HiRel products in the Aerospace, Defense, and High Reliability markets.
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Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)
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Micron Technology
Singapore, S00, SG
7d
Senior Product Engineer driving package and HBM product engineering activities, focusing on yield improvement, quality, cost, cycle time, and scale for next-generation High Bandwidth Memory products.
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Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)
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Micron Technology
Singapore, S00, SG
7d
Drive package and HBM product engineering activities to improve assembly yield, reduce defects, and optimize manufacturing processes for next-generation High Bandwidth Memory products.
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MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing)
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Micron Technology
Singapore, S00, SG
7d
Lead a high-performing team driving Media Health Manufacturing and activities for Micron's latest High Bandwidth Memory (HBM) products, focusing on Quality, Cost, Cycle Time, and Scale.
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Product Integration Lead, HIG High Bandwidth Memory
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Micron Technology
Singapore, S00, SG
7d
Integrate Micron's leading edge HBM products into end-system requirements and drive HBM development swimlane requirements to meet customer needs.
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Senior Manager, Product Marketing
Appliedmaterials
Santa Clara,CA
$172k–$236k
7d
Develop and execute business and product marketing strategies to drive market penetration, strengthen product positioning, and create sustainable competitive advantages for semiconductor equipment.
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Embedded software engineer(Temp)
MediaTek
Seongnam
7d
Investigate advanced TV and connectivity technologies, manage technical specifications between customers and MTK HQ, monitor chip design status, and maintain customer relationships for project information.
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Pricing & Quoting Solutions Specialist (f/m/div)
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Infineon Technologies
Maia, Porto, Portugal
7d
Develop strategies, refine processes, and implement initiatives for global pricing and quoting tools to support internal and external users.
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Senior Customer Technology Manager
ASML
Boise, ID, USA
$136k–$200k
7d
Shape customer technology roadmaps, translate customer needs into business opportunities and product requirements, and drive adoption of ASML innovations.
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Sales Manager
Ambiqmicroinc
Shenzhen, China
8d
Drive revenue growth for Ambiq's low-power semiconductor solutions in China by expanding accounts, securing design wins, and managing the pipeline from design-in to mass production.
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Director, Advanced Packaging Disruptive Technology (Based in Singapore)
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Applied Materials South East Asia
Singapore, Singapore
8d
Define and drive pathfinding strategy for N+2 and beyond advanced packaging technologies, leading disruptive innovation that shapes future integration architectures and unlocks new value creation opportunities.
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Product Engineer - Automotive ICs (m/f/d)
Nxp
Remote
8d
Own automotive IC products within the supply chain post-release, driving characterization, qualification, and high-volume production ramp-up.
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Application Engineer MEMS Microphones (f/m/div)
Infineon Technologies AG
Neubiberg, BAYERN
8d
Serve as the technical application expert for the MEMS Microphone sensor portfolio, leading technical reviews with customers and supporting them through the complete audio chain from design-in to troubleshooting.
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Product Pathfinding Engineer- HIG-TPG
Micron
Boise, Idaho, United States of America
8d
Develop JEDEC-HBM and Near Memory DRAM solutions, implementing 2.5D and 3D electrical and packaging innovations to build low-power solutions for ML and AI.
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Product Engineer - Automotive ICs (m/f/d)
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NXP Semiconductors
Remote
8d
Own automotive IC products within the supply chain post-release, driving qualification, ramp-up, and continuous improvement for high-volume production.
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NPI Engineer
Apple
Herzliya, Israel
8d
Bridge Engineering R&D and Manufacturing teams to ensure product data accuracy, manufacturing readiness, and resolve technical challenges during assembly processes.
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General Manager, After-Sales Product Management
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Bitmain Development Pte. Ltd.
Outram, S00, SG
8d
Lead the after-sales product management team for chip products, establishing support systems to safeguard customer satisfaction and market reputation.
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Senior Product Engineer
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Insight Global
Burlington, Ontario, Canada
CA$110k–CA$125k
8d
Senior NPI Product Engineer supporting new product development from concept through production release for advanced CMOS and BiCMOS semiconductor technologies.
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Product Marketing
Appliedmaterials
Santa Clara,CA
$174k–$240k
8d
Leads marketing and cross-functional teams to drive competitive advantage, revenue, and market share for semiconductor equipment and materials.
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Product Pathfinding Engineer- HIG-TPG
Micron
Boise, ID - Main Site, US
8d
Develop JEDEC-HBM and alternative Near Memory DRAM solutions, implementing innovative 2.5D and 3D electrical and packaging solutions to build lowest power per bit solutions for ML and AI.
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Advanced MCM Packaging Technology Development & Integration
MediaTek
HsinChu
8d
Lead feasibility assessment and development of advanced packaging technologies for wafer-level and panel-level applications, including 2.5D/3D/3.5D integration and Fan-out packaging.
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Business Development Manager – Optical Sensor Technologies (IFPD)
Broadcom
Germany-Regensburg
8d
Drive strategic market expansion and product roadmap for next-generation optical sensor and ranging technologies (LiDAR, time-of-flight) for industrial and automotive applications.
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IC Packaging Substrate Engineer, up to Staff
Qualcomm
Hsinchu City, Taiwan
8d
Development, evaluation, and qualification of next-generation IC substrate technologies for advanced semiconductor packaging, serving mobile, IoT, automotive, and 5G markets.
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RFFE Marketing Specialist
Broadcom
Malaysia-Penang B 1 & 2
9d
Support internal and external marketing activities for RF front end products, including pricing/quotation management, complex marketing reporting, and executive presentation preparation.
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Director, Hardware Engineering | Hardware design & development (enterprise & datacenter switching)
Cisco
Bangalore, India
10d
Lead a Hardware Development team to create industry-leading networking products (Switching, Routing, Wireless, Industrial) focusing on silicon, optics, and hardware platforms like Silicon One.
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Senior Manager, Business Development
Asm
AZ Phoenix (ASM America Inc.)
10d
Drive product market adoption and revenue growth by executing sales strategies, managing customer relationships, and supporting new product introductions in the semiconductor capital equipment industry.
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Business Development Head - ALD Products
Asm
AZ Phoenix (ASM America Inc.)
10d
Senior strategic leader defining and driving ASM's global business growth for advanced semiconductor devices, shaping market direction and forging executive customer partnerships.
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Lead II, IP Counsel
Asm
Leuven(ASM Belgium N.V.)
11d
Manage global intellectual property strategy and portfolio for process and engineering activities, harvesting invention disclosures and aligning protection with business leadership.
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Director, Product Development & External Manufacturing
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Corinex
Vancouver, British Columbia, Canada
11d
Lead execution of hardware and semiconductor product development programs and manage the external manufacturing ecosystem for Corinex's Broadband over Power Line (BPL) and smart-grid portfolio.
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Director of Engineering
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Svi Public Company Limited
Pathum Thani, Thailand
11d
Lead engineering organization for new product introduction (NPI), product industrialization, test engineering, and manufacturing engineering to ensure successful product transfer to mass production.
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高密PCB模组装联技术专家
Huawei
Dongguan, China
11d
Designing and implementing high-density PCB board and process solutions, reliability engineering, and quality platforms to ensure high-quality, high-reliability, and high-performance application of complex PCB modules.
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Application Engineer MEMS Microphones (f/m/div)
Infineon
Munich
11d
Serve as the technical application expert for the MEMS Microphone sensor portfolio, enabling customers to transform products into cutting-edge designs.
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Product Owner, Tapeout and Mask Operations
GlobalFoundries
IND - Karnataka - Bengaluru - North, IN
11d
Own and drive product outcomes for tapeout and mask operations solutions, including design data verification, product configuration, and related data platforms.
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Product Line Manager
Nordsonhcm
United Kingdom - Aylesbury
11d
Manage the product lifecycle, roadmap, and strategy for the Automatic X-Ray Semiconductor Metrology Product Line to maximize sales revenue and profitability.
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Senior Manager, Lifecycle Management & Reliability
Ciena
Ottawa, CA
$130k–$253k
11d
Lead multidisciplinary hardware engineering teams to manage the full lifecycle of complex packet and optical networking products, ensuring reliability, manufacturability, and supply continuity.
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Vice President, Product Engineering
Lumentum
USA - CA - San Jose (Ridder)
11d
Senior leader accountable for product engineering strategy, execution, and organizational performance across multiple wafer fabrication sites producing indium phosphide (InP)-based optoelectronic devices.
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Product Manager – Quantum System
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Photonic Inc.
Coquitlam, British Columbia, Canada
CA$141k–CA$194k
11d
Own the product definition, roadmap, and delivery of Photonic's Physical Qubit Layer, the foundation of their quantum computing technology stack.
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PDK Parasitic Extraction (PEX) Engineering manager
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Intel Corporation
KA, IN
11d
Lead a team of engineers specializing in PDK development and validation, focusing on Parasitic Extraction (PEX) collaterals and flows for Intel process technologies.
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R2613426 Senior Technical Marketing Manager – Advanced Packaging
Appliedmaterials
Santa Clara,CA
$174k–$240k
11d
Define product value propositions, build competitive positioning, and drive customer adoption for advanced semiconductor packaging solutions.
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PDK Parasitic Extraction (PEX) Engineering manager
Intel
India, Bangalore
11d
Lead a team of engineers specializing in PDK development and validation with a focus on Parasitic Extraction (PEX) Collaterals and Flows for Intel process technologies.
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Electronics Design Lead
Valeo
Chennai, Tamil Nadu
11d
Lead electronics design discipline, ensuring robust design for manufacturing, validation, and compliance with design rules and customer requirements.
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Senior Staff Product Marketing Specialist (MCU/MPU and automotive experience required)
Renesas-Electronics
Farmington Hills, Michigan, us
12d
Regional Product Marketing Specialist responsible for go-to-market strategy, execution, and growth of MCU/MPU/Connectivity portfolio in a specific territory, acting as the 'Voice of the Region' to align local requirements with global product roadmap.
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Principal Product Manager (Hyperscalers)
Renesas-Electronics
San Jose, CALIFORNIA, us
$210k–$270k
12d
Own the product development process and execution of key power delivery products from NPI through volume ramp, ensuring customer commitments are met in a supply-constrained environment.
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SiP Package Development Specialist (m/f/d)
Aumovio
Regensburg, BY, de
12d
Define technically viable and cost-effective System-in-Package (SiP) concepts, select package architectures and technologies, and coordinate feasibility work with external manufacturing partners for automotive applications.
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Graduate – Product Engineer
Infineon
Leominster, MA
12d
Lead R&D backend operations to ensure efficient product development, optimize workflows, and support production ramp-up for semiconductor products.
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Software Engineer - Principal
Siemens-Eda
Fremont, CA, United States
12d
Senior R&D Product Lead driving strategy, roadmap, and customer adoption for Questa Verification IQ (QVIQ), a web-based collaborative verification management product integrating with simulation and CI/CD systems.
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Director, Digital IP Roadmap
Silabs
Austin, US
$176k–$326k
12d
Define and drive the roadmap for a digital IP portfolio of 200+ IPs, connecting product needs with IP development and evolution.
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SiP Package Development Specialist (m/f/d)
AUMOVIO SE Haupverwaltung
Deutschland
12d
Define technically viable and cost-effective System-in-Package (SiP) concepts, select package architectures and technologies, and coordinate with manufacturing partners for automotive sensor solutions.
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Silicon CAD Technical Product Manager
Ericsson
Austin,Texas,United States
12d
Consolidate engineering needs into a prioritized portfolio of initiatives and translate them into executable plans aligned with ASIC project milestones for Ericsson's telecommunications portfolio.
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PDK Management DTCO Engineer - TPG
Micron
Richardson, Texas, United States of America
12d
Manage PDK change management, verification, benchmarking, and release scheduling for advanced memory and storage solutions.
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