Product Pathfinding Engineer- HIG-TPG
Core
Develop JEDEC-HBM and Near Memory DRAM solutions, implementing 2.5D and 3D electrical and packaging innovations to build low-power solutions for ML and AI.
Role type
Senior Product Pathfinding Engineer (Semiconductor/DRAM)
Builds
Next-generation HBM and DRAM memory products
Domain
Semiconductor industry, High Bandwidth Memory (HBM), DRAM
Required skills
High-speed datapath design, logic development, advanced circuit analysis, electrical and packaging engineering, debugging, problem-solving, cross-functional collaboration
Preferred skills
Technical leadership, DRAM architecture knowledge, yield and manufacturing efficiency expertise, global team collaboration
Technologies
JEDEC standards, 2.5D/3D packaging, Heterogeneous Integration (HIG), DRAM architecture
Responsibilities
Initiate collaborations with customers and manufacturing to capture requirements for next-gen product development; Plan responses to technology node changes and ensure test coverage for Alpha products; Resolve silicon findings within encouraged timelines; Forge alliances with Build, Verification, and System Compatibility teams; Orchestrate build readiness improvement initiatives; Align product strategies with leadership objectives and timelines.