Advanced MCM Packaging Technology Development & Integration
Core
Lead feasibility assessment and development of advanced packaging technologies for wafer-level and panel-level applications, including 2.5D/3D/3.5D integration and Fan-out packaging.
Role type
Senior IC packaging technology development engineer
Builds
Advanced packaging solutions for logic and high-bandwidth memory integration (HBM, LPDDR)
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Feasibility assessment, 2.5D/3D/3.5D integration design, Fan-out packaging design, DOE execution, Yield analysis, Engineering issue resolution, Supply chain management, Cross-functional project leadership
Preferred skills
NPI planning, Mass production process improvement, Cost structure analysis, Production line audit
Technologies
Wafer-level packaging, Panel-level packaging, HBM, LPDDR, OSAT, Wafer foundries
Responsibilities
Lead feasibility assessment and development of advanced packaging technologies, Plan pilot production processes and execute DOE, Manage technical collaboration with wafer foundries and OSATs, Lead cross-functional collaboration across IC design, layout, testing, quality assurance, and reliability teams
Seniority
Senior, hands-on IC
