Semiconductor Product Engineering

846 open positions

Design for Manufacturing (DFM) Engineer - PCBA AppleBengaluru, India 8mo Lead the development and ramp for next-generation Apple products by ensuring Printed Circuit Board Assembly (PCBA) designs are manufacturable and driving out costs in design and tooling.
HMI Regional Product Management (RPM) ASMLChitose, Japan 8mo Regional Product Management Manager responsible for new product penetration strategy, technical engagement projects, and customer R&D/HVM adoption for inspection and metrology tools.
Analog Mixed -Signal IC Designer FlirCanada - Waterloo, ON $94k8mo Design, simulate, verify, and debug analog and mixed-signal CMOS circuits for high-performance image sensors used in machine vision, aerospace, and defense.
Leitung Entwicklung und Technologie (m/w/d) POG Präzisionsoptik Gera GmbHLöbichau, THUERINGEN 9mo Leading product and technology development for custom optical systems and components serving semiconductor, measurement, military, aerospace, and life science industries.
Senior Staff Engineer Package Technology InfineonMelaka 9mo Define and develop semiconductor packages for new products from concept to realization, ensuring they meet electrical, thermal, reliability, and mechanical requirements.
Principal Customer Engagement Engineer CadenceSHANGHAI 9mo Act as a technical bridge between EDA tools and foundry design service/PDK teams and design houses to enable and deploy design solutions for advanced semiconductor technology development.
Product Engineer III AmatSanta Clara,CA $124k9mo Designing and optimizing manufacturing processes for display and semiconductor technologies, including hardware characterization and troubleshooting.
Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory MicronSingapore, Singapore 10mo Drive Media Health Manufacturing and activities for Micron's latest Heterogeneous Integration High Bandwidth Memory (HBM) products, focusing on DRAM, Interface die, and stacked products.
Component Engineering Technical Leader - Memory CiscoTaipei, Taiwan 10mo Domain authority for memory technologies, advising on selection, validation, and qualification of memory components for Cisco products.
CDI - Silicon Photonics Project Manager (F/H) STMicroelectronicsGrenoble, France 10mo Drive and coordinate collaboration between data communications/telecom customers and ST stakeholders through a wafer foundry business model (COT), supporting clients from silicon technology evaluation through design prototyping to production ramp-up.
Principal Product Engineer - Verification CadenceGYEONGGI-DO (Seoul) 11mo Lead technical evaluations and customer engagements for Cadence Verification Division products, bridging engineering and sales to drive product direction.
Lead Product Engineer - Verification CadenceGYEONGGI-DO (Seoul) 11mo Lead technical evaluations and customer training for Cadence Verification Division products, bridging engineering and sales to drive product direction.
Staff Module Engineering Program Manager AevaMountain View, CA 11mo Lead complex technical development efforts for photonics and semiconductor modules, managing build/test activities, vendor relationships, and high-volume manufacturing processes to deliver products on time.
CDI – Ingénieur Règles de Dessin - F/H STMicroelectronicsCrolles, France 11mo Define design rules at the interface of process and design to enable the development of optimized and competitive semiconductor circuits.
IC Package Integration Lead AppleAustin, United States of America 11mo Lead package integration and architecture efforts to bring innovative packaging solutions from concept to mass production for advanced semiconductor products.
Manager, DFT Architecture NVIDIAIsrael, Yokneam 1y Lead the DFT architecture and test solutions for NVIDIA's HCA (High Capacity Accelerator) network products to ensure high-quality, cost-effective delivery.
Senior Engineer, Process Integration, Advanced NAND MicronSingapore, Singapore 1y Lead the integration of cutting-edge 3D NAND technology and develop a strategic technology roadmap for the next 5+ years.
Account Manager JP Siemens-EdaTokyo, JPN, Japan 1000k–1500k1y Drive sales and business development for Electronic Design Automation (EDA) software supporting semiconductor, PCB, and electrical product design automation.
Calibre Product Architect Siemens-EdaTokyo, JPN, Japan 1y Bridging the gap between Siemens EDA's global consulting team and customers to deliver solutions for semiconductor physical verification tools (Calibre).
IoT Segment Leader: Industrial, Robotics & Power GlobalFoundriesSanta Clara, US $166k1y Define market requirements and drive design wins for industrial IoT, robotics, and power systems by leveraging semiconductor IP and compute architectures.
VLSI Product Engineer AppleHerzliya, Israel 1y Define, characterize, and transfer VLSI products to mass production using state-of-the-art silicon technologies.
Career Returnee MicronPenang, Malaysia - Grande 1y A program to help talented individuals relaunch their careers after a career break by matching them to open positions within Micron Malaysia.
Analog IC Design Lead (PMIC) Monolithicpower 1y Lead the end-to-end design and development of power management mixed-signal circuits, specifically PMIC products, from concept to market launch.
SSD Business Manager MonolithicpowerSan Jose, CA $150k1y Drive business and marketing for SSD/storage products, influencing product development strategy and execution while collaborating with sales and engineering teams.
Design Engineering Architect CadenceBANGALORE 1y Provide technical leadership in conceptualizing and architecting the frontend digital design of products, defining micro-architecture, and driving implementation from concept to silicon.
Analog/Mixed-Signal Technical Program Manager MediaTekHsinChu 2y Leading and integrating analog IP teams and technology to enable new System-on-Chip (SoC) products across multiple vertical product lines.
Senior Product engineer STMicroelectronicsCatania, Italy €43k–€53k2y Develop innovative Silicon Carbide (SiC) power products, overseeing the lifecycle from conception to obsolescence, defining testing programs, and analyzing data to meet datasheet conditions.
Lead Product Engineer - UCIe & Functional Verification CadenceBANGALORE, IN 2y Lead Product Engineer driving UCIe Verification IP portfolio adoption and product definition for top-tier customers.
Hardware Research Analyst SemiAnalysisHillsboro, OR Conduct teardowns of leading-edge AI and datacenter hardware to produce published technical analysis and industry reports.
EDA/IP寻源经理（上海/基础设施） - 芯片研发 ByteDance上海 Manage EDA/IP resource planning and supplier development for ASIC projects, optimizing hardware for specific business scenarios.
商业分析师（存算与AI） - 芯片研发 ByteDance北京 Build cost models and financial forecasts for存算一体 (compute-in-memory) AI chips to support product solutions and pricing negotiations.
EDA/IP寻源经理（北京） - 芯片研发 ByteDance北京 Manage EDA/IP resource planning and supplier development for ASIC projects to optimize hardware for ByteDance's business scenarios.
前沿技术研究与合作专家（芯片方向）（北京/上海） ByteDance北京 Sourcing, negotiating, and managing academic research projects and technical pre-research in the chip domain.
Semiconductor 3D Architecture, Director AdeiaRemote $195k–$245k Define long-term technology strategy and lead the memory logic innovation program for semiconductor platforms and IP licensing.
About the job SK GroupKorea Developing power semiconductor platform technologies and devices (BCD, HV devices), process integration, device structure optimization, and leading process/option device development.
硬件产品数据管理/治理专家-Data ByteDance杭州 Design and govern hardware material classification, coding, attributes, and multi-level BOM structures for enterprise and consumer electronics.
About the job SK GroupKorea Establishing Power Process technology roadmaps and defining process development specifications based on customer and market requirements.
About the job SK GroupKorea Developing power semiconductor platform technologies and devices (BCD, HV devices), process integration, device structure optimization, and product engineering including yield improvement and defect analysis.
Co-Packaged Optics, Director AdeiaRemote $202k–$250k Director leading technology strategy, architecture development, and IP generation for co-packaged optics and silicon photonics.
产品工程师（存算与AI） - 芯片研发 ByteDance北京 Product Engineer for in-memory computing (IMC) chips, managing NPI from tape-out to mass production, coordinating with OSAT/Foundry, and driving yield improvement for high-efficiency AI chips.
MR显示光学专家（OLED/Micro-OLED方向） - PICO ByteDance上海 Manage technical requirements and design reviews for OLED/Micro-OLED display devices and optical solutions for XR headsets.
芯片量产项目经理-PICO ByteDance上海 Lead end-to-end integration and mass production launch of terminal products based on new chips, managing system-level design, validation, and issue resolution.
专利工程师（智能硬件方向） ByteDance北京 Guide R&D and patent agents in patent mining and filing for smart hardware, manage and analyze company and industry patents, and support patent disputes.
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Senior Staff Engineer Chip Package Board - CoDesign Flow and Methodology (f/m/div) Villach Define and drive the technical roadmap for Chip-Package-Board (CPB) design methodologies, flows, tools, and digital engineering capabilities to accelerate design convergence and improve quality.
Staff Engineer Product Development for Power MOSFETs (f/m/div) Infineon Technologies Austria AGVillach Drive product development for high-voltage Power MOSFETs (Si and SiC) and innovative multicomponent solutions like switch-and-driver IC combinations.
Staff Engineer - Wafer Technology & Device Development (f/m/div) Infineon Technologies Austria AGVillach Develop innovative wafer technology and power device concepts for automotive applications, optimizing device geometry and process flows.

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