Product Pathfinding Engineer- HIG-TPG
Core
Develop JEDEC-HBM and alternative Near Memory DRAM solutions, implementing innovative 2.5D and 3D electrical and packaging solutions to build lowest power per bit solutions for ML and AI.
Role type
Senior Product Pathfinding Engineer (High Bandwidth Memory)
Builds
Next-generation HBM and Near Memory DRAM products
Domain
Semiconductor / Memory / High Bandwidth Memory
Deliverable
production ML models
Required skills
High-speed datapath design, logic development, advanced circuit analysis, electrical and packaging engineering, debugging, problem-solving, cross-functional collaboration
Preferred skills
Technical leadership, DRAM architecture knowledge, yield and manufacturing efficiency expertise, global team collaboration
Technologies
JEDEC-HBM, 2.5D, 3D, DRAM
Responsibilities
Initiate collaborations with customers, Test, and Manufacturing to capture key requirements; Work with System Engineering and Component Validation to plan responses to technology node changes; Resolve silicon findings within timelines; Forge alliances with Build, Verification, and Silicon Strategy teams; Identify and orchestrate ongoing improvement initiatives in build readiness; Align product strategies with leadership objectives.
