SiP Package Development Specialist (m/f/d)
Core
Define technically viable and cost-effective System-in-Package (SiP) concepts, select package architectures and technologies, and coordinate with manufacturing partners for automotive sensor solutions.
Role type
Senior IC packaging engineer (SiP)
Builds
System-in-Package (SiP) concepts, prototypes, and design guidelines for automotive sensor solutions
Domain
Automotive semiconductor packaging
Required skills
Semiconductor package development, advanced packaging, System-in-Package, heterogeneous integration, IC design methodology, EDA tools, package substrates, redistribution layers, interposers, die attach, wire bonding, flip chip, micro-bumps, underfills, molding compounds, thermal interface materials, package architecture trade-offs, manufacturability, reliability, qualification principles, supplier assessment, feasibility studies, risk analysis
Preferred skills
Automotive semiconductor reliability expectations, qualification and quality methods, technical supplier assessment, structured risk analysis
Technologies
EDA tools, 2D/2.5D/3D SiP concepts, organic substrates, redistribution-layer structures, interposers, embedded components, bump and pad concepts, die placement constraints, assembly flows, package design rules
Responsibilities
Define SiP concepts using bare-die known-good-die components, passives, and chiplets; Select and assess package architectures, substrate and interposer technologies; Coordinate packaging feasibility work with external manufacturing partners; Derive package-level requirements from product architecture and targets; Develop and compare 2D, 2.5D, and 3D SiP concepts; Lead package technology trade-off studies; Establish package specifications, architecture documents, and design-rule baselines; Monitor packaging technologies and translate findings into the SiP technology roadmap
Seniority
Senior, hands-on IC
