SiP Package Development Specialist (m/f/d)
Core
Define technically viable and cost-effective System-in-Package (SiP) concepts, select package architectures and technologies, and coordinate feasibility work with external manufacturing partners for automotive applications.
Role type
Senior IC packaging engineer (SiP)
Builds
2D, 2.5D, and 3D SiP concepts including organic substrates, redistribution layers, interposers, and embedded components
Domain
Semiconductor packaging / Automotive electronics
Required skills
SiP concept definition, substrate and interposer technology selection, package architecture trade-offs, design for manufacturability, reliability qualification, supplier coordination, simulation definition, technical documentation
Preferred skills
Automotive semiconductor reliability expectations, structured risk analysis, technical supplier assessment
Technologies
EDA tools, simulation software (electrical/thermal/thermo-mechanical), bare-die known-good-die components, flip chip, micro-bumps, underfills, molding compounds
Responsibilities
Define SiP concepts and package stack-ups, assess substrate and interposer technologies, coordinate with outsourced assembly and test providers, derive package-level requirements from product architecture, lead trade-off studies, establish design rules and bills of material, support prototype planning and failure analysis, monitor industry standards and update technology roadmap
Seniority
Senior, hands-on IC
