IC Packaging Substrate Engineer, up to Staff
Core
Development, evaluation, and qualification of next-generation IC substrate technologies for advanced semiconductor packaging, serving mobile, IoT, automotive, and 5G markets.
Role type
Senior IC Packaging Substrate Engineer (up to Staff)
Builds
Next-generation IC substrates and PCBs for high-volume manufacturing
Domain
Semiconductor packaging, IC substrate, PCB manufacturing
Required skills
IC substrate technology development, PCB design rule management, New Product Introduction (NPI), Design for Manufacturing (DFM) methodology, Technical program management, Supplier management (OSATs/CMs), High-volume manufacturing troubleshooting, Reliability testing and qualification, Statistical process control (DOE, FMEA, control plans), Material characterization and data analysis
Preferred skills
FCCSP/PCB manufacturing experience, Automotive application experience, Organic laminate manufacturing knowledge, JEDEC standard component reliability testing, Statistical data analysis proficiency
Technologies
FCCSP, PCB, Organic laminate, JEDEC standards
Responsibilities
Develop and qualify next-generation substrate technologies; Manage IC substrate and PCB design rule sets; Lead new product introduction (NPI) and drive DFM methodology; Manage technical programs for complex process/product developments; Oversee IC substrate/PCB suppliers for HVM capability and quality control; Troubleshoot RMA issues and reliability failures
Seniority
Senior, hands-on IC