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Software Engineering
› Hardware Verification
Hardware Verification
1,136 open positions
EDA & CAD Manager
Lumilens
San Jose
1mo
Build and manage a robust EDA and CAD design environment supporting multiple IC design disciplines (analog, mixed-signal, digital) to enable faster, reliable silicon development.
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Digital Design Engineering Intern
Texas Instruments
OSLO, Norway
1mo
Summer internship for students to gain hands-on experience in digital design engineering at Texas Instruments.
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Technology Architecture Engineering Intern (Summer 2027)
GlobalFoundries
USA - New York - Malta
1mo
Conduct reverse engineering analyses and structural investigations of semiconductor technologies to strengthen technology competitiveness.
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Digital Design Engineering Intern
Texas Instruments
OSLO, Norway
1mo
Summer internship for students to gain hands-on experience in digital design engineering at Texas Instruments.
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Design Verification Infrastructure & Performance Engineer
Advanced Micro Devices, Inc
Iasi, Romania
1mo
Optimize simulation and build flows for AMD silicon development by improving runtime, memory usage, and verification productivity.
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Software Engineer — AI-Native CAD Integrations
Quilter
USA
1mo
Build AI-native integrations between Quilter's PCB design platform and leading CAD tools (Altium, Cadence, Siemens) by parsing, translating, and generating complex, often undocumented binary and text-based file formats.
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Senior/Staff NAND Design Rule Engineer
Micron
Hyderabad, Telangana, India
1mo
Define physical design rules for next-generation 3D NAND development from conception to production ramp, ensuring accuracy and feasibility across layout and architecture options.
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Product Development Engineer
Micron
Boise, Idaho, United States of America
1mo
Develop new strategies for DRAM Design for Test (DFT), test flow, and fail pattern recognition to improve test time and quality.
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Staff STPG NAND Product Development Engineer
Micron
Singapore, Singapore
1mo
Staff engineer owning the full learning loop of NAND Test Chip Vehicle (TCV) development, driving pre-silicon validation, post-silicon characterization, and technology learning to improve future NAND architectures.
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Associate Engineer, Failure Analysis Engineering
Analogdevices
Philippines, Cavite, GTC
1mo
Develop software and applications to support semiconductor failure analysis, ensuring cycle time and quality commitments while collaborating with cross-functional engineering teams.
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Gate-level IR/EM CAD/NLP Engineer
Apple
Austin, United States of America
1mo
Developing an analytic platform to identify and recommend solutions for signoff IR/EM analysis using machine learning and large language models.
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Software Engineer II: Hardware Verification Compiler
Cadence
BELO HORIZONTE, BR
1mo
Develop high-performance compiler capabilities for large-scale model checking and structural checking within the Palladium emulation system.
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STAGE – Génération de netlists SPICE multi-simulateur – F/H
STMicroelectronics
Crolles, France
1mo
Develop a simulator-independent abstraction layer for SPICE netlist generation and measurement extraction to improve IP validation flow portability and reusability.
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Agentic AI Architect
Broadcom
USA-TX-Austin - River Place B7
$129k
1mo
Design, deploy, and optimize autonomous multi-agent AI architectures to revolutionize IP block development and support workflows across complex semiconductor design phases.
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[2027 Campus Hire] Memory Design Automation – Memory Compiler
↗
MediaTek
1mo
Design and deliver high-quality design kits for cutting-edge technology node SRAM compilers.
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CAD Engineer - Signoff Infrastructure
Apple
Austin, United States of America
1mo
Develop full-stack web applications, dashboards, and data visualization tools for the Signoff infrastructure to validate chip designs against manufacturing, timing, and power criteria.
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CAD Engineer - Signoff Infrastructure
Apple
San Jose, United States of America
1mo
Develop full-stack web applications, dashboards, and data visualization tools for the Signoff infrastructure to validate chip designs against manufacturing, timing, and power criteria.
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Engineer, Electrical Engineering
Asm
Singapore (ASM Front-End Mfg (S) Ltd)
1mo
Technical lead for electrical systems within advanced semiconductor equipment, driving system-level design, integration, and validation for products enabling 5G, AI, and autonomous driving.
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Senior Principal Software Engineer
Cadence
SAN JOSE, US
$161k
1mo
Architect and enhance the Xcelium RTL/logic simulator engine and Timing Constraints Verification technology for future AI and hyperscale chip designs.
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Mechanical (Finite Element) Simulation Engineer
Hpe
Aguadilla, Puerto Rico, Puerto Rico
1mo
Develop and apply advanced modeling and simulation techniques to support the design, development, validation, reliability, and optimization of mechanical, thermal, electronic, and system-level products.
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Application Engineering Manager
GlobalFoundries
Austin, US
$118k
1mo
Lead a global team of Application Engineers to support customer onboarding, solution enablement, software integration, and production ramp for MIPS technologies.
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Principal Tape Out Engineer
Nxp
Singapore
1mo
Final checkpoint role ensuring semiconductor design data meets manufacturing requirements and quality standards before fabrication.
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Senior EDA Software Engineer
Qualcomm
Singapore, Central Singapore, Singapore
1mo
Design, develop, and implement software solutions for R&D EDA software systems for Power Devices (PD), focusing on RF front-end module design and RF lab equipment test.
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Engineer/Senior Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Micron
Singapore, Singapore
1mo
Drive manufacturing test flow development, validation, and yield improvement for next-generation High Bandwidth Memory (HBM) products including DRAM, interface, and stacked die solutions.
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CAD Engineer - Signoff Infrastructure
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Apple
San Jose, CA, US
$129k–$195k
1mo
Build and enhance full-stack web applications, dashboards, and data visualization tools for the Signoff infrastructure used by Apple SOC design groups to validate chip designs against manufacturing, timing, and power criteria.
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STAGE - Génération par IA de composants RF passifs F/H
STMicroelectronics
Crolles, France
1mo
Develop an automated generator for RF passive components using AI and algorithms to discover new structures and optimize performance under geometric and electrical constraints.
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Engineer/Senior Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
Micron
Fab 10A, Singapore
1mo
Drive Media Health manufacturing execution for next-generation HBM products (DRAM, interface, and stacked die) by optimizing test flows, improving yield, and reducing test time.
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AI / ML DFT Project Lead
Advanced Micro Devices, Inc
Santa Clara, California
1mo
Lead AI/ML and agentic AI initiatives to improve productivity, quality, scalability, and predictability of DFT/DFD design and verification flows for high-performance SoCs.
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Head of Formal Verification (m/f/d)
LUBIS EDA GmbH
Hybrid / Kaiserslautern
1mo
Own the direction of the formal verification consulting business, including roadmap, customer strategy, organization structure, and talent development.
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Physical Design Application Engineer
proteanTecs
Seoul, KR
1mo
Support customers with physical design implementation and signoff flows for advanced process chips.
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Senior Technical Program Manager – Silicon Co-Design
NVIDIA
US, CA, Santa Clara
$200k
1mo
Senior Technical Program Manager leading System-on-Chip (SoC) programs from architecture through tape-out, bring-up, and productization, driving alignment across silicon, systems, and software.
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Sr Design Automation Engineer, Simulation
Micron
Boise, ID - Main Site, US
1mo
Develop and optimize scalable software systems and AI-assisted automated workflows for analog and digital circuit simulation and verification flows.
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Intern Design Engineer - HIG HBM
Micron
Richardson, TX, US
1mo
Intern Design Engineer for High Bandwidth Memory (HBM) circuits, focusing on design, simulation, verification, and AI-assisted workflows.
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Staff Physical Design Verification, CAD
Micron
Richardson, Texas, United States of America
$130k
1mo
Develop, integrate, and debug Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits to increase design productivity and reliability.
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Senior GPU Architect, Simulation SystemC, TLM
NVIDIA
US, CA, Santa Clara
$184k
1mo
Design and implement simulation infrastructure using C++, SystemC, and Transaction Level Modeling (TLM) to support GPU architects in building, debugging, and validating functional models for next-generation chip architectures.
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Senior Silicon Product Definition Engineer
NVIDIA
US, CA, Santa Clara
$168k
1mo
Define product configurations and drive optimization for GPU, CPU, and SoC products by analyzing silicon data to maximize performance, power efficiency, yield, and quality.
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Lead C++ Software Engineer
Cadence
Burlington, MA, US
$102k
1mo
Developing the world's fastest emulator compiler for the Palladium Platform, focusing on large-scale compile problems like logic optimization, partitioning, and scheduling.
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Intern: Software Engineering: Hardware Verification R&D
Cadence
BELO HORIZONTE, BR
1mo
Develop Functional Safety solutions for the emulation environment using Cadence's proprietary Palladium hardware platform.
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Software Engineer Intern
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Marvell Technology
Madrid, Community of Madrid, Spain
€23k–€33k
1mo
Develop functional models to simulate System-on-Chip (SoC) architectures and write embedded software to test and validate these models.
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Senior/ Staff Design Automation Engineer, Scribe Layout Design Non-Array
Micron
Hyderabad - Phoenix Aquila, India
1mo
Design, layout, and verification of CMOS electrical test structures for device development, compact modeling, reliability modeling, and fab process monitoring.
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Principal Eng Device Engineering, Silicon Phonics Compact Modeling (2027 New College Grad)
GlobalFoundries
USA - New York - Malta
$85k
1mo
Develop, validate, and support production-quality compact models for silicon photonic devices used in advanced Process Design Kits to enable accurate simulation and customer design success.
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Intern Design Engineer - HIG HBM
Micron
Richardson, Texas, United States of America
1mo
Design, simulation, analysis, and verification of High Bandwidth Memory (HBM) memory and logic circuits for AI, high-performance computing, and data-center applications.
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Staff Physical Design Verification, CAD
Micron
Richardson, TX, US
1mo
Develop, integrate, and debug Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits to increase design productivity and reliability.
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Sr Design Automation Engineer, Simulation
Micron
Boise, Idaho, United States of America
$104k
1mo
Develop and optimize scalable software systems and AI-assisted automated workflows for analog and digital circuit simulation and verification flows.
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Junior DfT Design Engineer - MCU
Nxp
Catania, IT
€31k
1mo
Develop and implement digital Design-for-Test (DFT) solutions for complex semiconductor devices to improve product quality, testability, and manufacturing efficiency.
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Stage Ingénieur : Génération semi-automatique de modèles, stimuli et testbenches par agents IA (F/H)
Nxp
Toulouse, FR
1mo
Developing AI agents to semi-automatically migrate legacy integrated circuit behavioral models to newer technology nodes and generate associated verification stimuli and testbenches.
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ECAD Principal Engineer
Arm
Chandler, Arizona
$250k
1mo
Design and develop automation tools to support package designs for next-generation SoCs in IoT, Automotive, and Compute spaces.
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Engineer- Tech PNR methodology
Arm
Bengaluru, India
1mo
Develop and deploy design methodologies, flows, scripts, and automation for advanced semiconductor process nodes to achieve optimal performance, power, and area (PPA) on CPU designs.
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Engineer - CAD SW
Arm
Bengaluru, India
1mo
Design, develop, test, and maintain software solutions and automation tools for optimized design flow, methodology, and full CAD solutions for industry-leading compute subsystems and SoCs.
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Advanced Packaging Technologist (Mechanical Modeling)
Advanced Micro Devices, Inc
Austin, Texas
1mo
Define and drive next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO) for data center and high-performance computing systems.
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