Intern Design Engineer - HIG HBM
Core
Intern Design Engineer for High Bandwidth Memory (HBM) circuits, focusing on design, simulation, verification, and AI-assisted workflows.
Role type
Intern IC semiconductor design engineer (HBM)
Builds
HBM memory and logic circuits for AI, high-performance computing, graphics, and data-center applications
Domain
Semiconductor / Memory / AI-assisted engineering
Deliverable
production ML models | product features
Required skills
Verilog, SystemVerilog, VHDL, Python, Perl, Tcl, C/C++, Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices
Preferred skills
HBM/DRAM/SRAM/DDR/LPDDR architecture knowledge, RTL design/synthesis/timing analysis/verification, Linux/Unix scripting, EDA tools (VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso), VLSI/ASIC/FPGA experience
Technologies
VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, Python, Perl, Tcl, C/C++, Verilog, SystemVerilog, VHDL
Responsibilities
Assist with design, simulation, analysis, and verification of HBM memory and logic circuits; Support RTL development, circuit implementation, timing/power analysis, and functional validation; Develop scripts, automation solutions, and AI-Assisted workflows; Collaborate with cross-functional teams on technical reviews and debug activities; Document technical work, experimental results, and design methodologies
Seniority
Intern