Advanced Packaging Technologist (Mechanical Modeling)
Core
Define and drive next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO) for data center and high-performance computing systems.
Role type
Senior IC mechanical modeling architect (advanced packaging)
Builds
Next-gen packaging platforms, board-level architectures, and cooling solutions for data center and HPC systems
Domain
Semiconductor manufacturing / Advanced packaging / Mechanical engineering
Deliverable
production ML models
Required skills
Mechanical and multi-physics modeling, FEA, electro-thermal and electro-optical integration, SMT and mechanical assembly process optimization, failure analysis, technology readiness assessment, material science, high-layer-count PCB design, warpage and stiffness control
Preferred skills
AI/ML-based engineering workflows (surrogate modeling, automated optimization), experimental test plan design, lab collaboration for model validation, connector strategies
Technologies
FEA, multi-physics simulation tools, SMT equipment, electro-optical components, thermal management solutions
Responsibilities
Drive model-based architecture and design decisions for advanced package technologies; Develop and validate mechanical and multi-physics models; Partner with manufacturing to optimize SMT and assembly processes; Engage with suppliers to align material properties and process capabilities; Define targets for mechanical technology development; Serve as subject-matter expert for package and board-level architectures
Seniority
Senior, hands-on IC
