Intern Design Engineer - HIG HBM
Core
Design, simulation, analysis, and verification of High Bandwidth Memory (HBM) memory and logic circuits for AI, high-performance computing, and data-center applications.
Role type
Intern Design Engineer (Semiconductor/HBM)
Builds
Industry-leading HBM memory solutions and semiconductor technologies
Domain
Semiconductor / Memory / AI Hardware
Deliverable
production ML models
Required skills
Verilog, SystemVerilog, VHDL, Python, Perl, Tcl, C/C++, Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design (via careerplan.io/jobs/44544865-intern-design-engineer-hig-hbm-at-micron)
Preferred skills
HBM/DRAM/SRAM/DDR architecture knowledge, RTL design/synthesis/verification, Linux/Unix scripting, Semiconductor EDA tools (VCS, Xcelium, PrimeTime, Innovus, Virtuoso)
Technologies
VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, Python, Perl, Tcl, C/C++
Responsibilities
Assist with design, simulation, analysis, and verification of HBM circuits; Support RTL development, timing/power analysis, and functional validation; Develop automation scripts and AI-Assisted workflows; Collaborate with cross-functional teams on technical reviews and debugging; Document technical work and design methodologies.
Seniority
Intern
