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Hardware & Physical Engineering
› Semiconductor Process Engineering
Semiconductor Process Engineering
3,355 open positions
Process Engineer III - (E3)
Amat
Santa Clara,CA
$124k–$124k
2mo
Designing and optimizing manufacturing processes for display and semiconductor technologies, specifically developing next-generation CVD products and materials for device nodes.
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Advanced Packaging Singulation Engineer
Intel
US, New Mexico, Albuquerque
$121k–$121k
2mo
Operate, optimize, and maintain high-volume semiconductor manufacturing equipment and processes to ensure control over critical dimensions and defectivity.
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Laser Semiconductor Engineer
Lumentum
Japan - Sagamihara
2mo
Plan and develop whole wafer processes for NPI from an integration standpoint, leading projects to mature individual process steps for mass production.
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Semiconductor Equipment Applications Eng
Micron
Boise, ID - Main Site
2mo
Own inspection equipment strategies to keep critical learning flowing through Technology Development and manufacturing, working hands-on with optical inspection tools to detect defects and improve tool efficiency.
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Equipment Technician-Implant
TSMC
USA-Washington
$0k–$0k
2mo
Maintain, troubleshoot, and repair semiconductor implantation equipment in a clean room manufacturing environment.
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Installation Engineer
Amat
Dresden,DEU
$52k–$52k
2mo
Install, commission, maintain, and upgrade semiconductor manufacturing equipment at customer sites, ensuring operational readiness and resolving technical issues.
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Fab Equipment Engineer
Broadcom
Singapore-Senoko
2mo
Maintain, repair, and optimize high-volume semiconductor manufacturing equipment in a cleanroom to ensure uptime and yield.
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Semiconductor Shift Maintenance Engineer or Technician - Diffusion 80 – 100% (f/m/d)
Hitachi
Lenzburg, Aargau, Switzerland
2mo
Maintain semiconductor diffusion equipment to ensure maximum uptime, reliability, and continuous improvement of production tools.
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Senior Mechanical Engineer
Metoxinternationalinc
Houston (11331 Tanner Rd)
2mo
Design, development, testing, and continuous improvement of mechanical systems for MOCVD and thin-film deposition manufacturing equipment.
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Sr. Manager, NPI PM (Semiconductor)
Microsoft
United States, Washington, Redmond
2mo
Lead New Product Introduction (NPI) execution across silicon development and manufacturing lifecycle, ensuring supply chain readiness and successful product launches.
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Process Engineering Intern
Asm
Tama(ASM Japan K.K.)
2mo
Analyze PEALD SiN gap-fill processes to identify effective deposition parameters and build physical/chemical models for performance improvement.
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Senior Engineer I, Process Engineering
Asm
Tama(ASM Japan K.K.)
2mo
Develop new processes for semiconductor fabrication, specifically focusing on PEALD and PECVD technologies.
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Senior Engineer I, Process Engineering
Asm
Tama(ASM Japan K.K.)
2mo
R&D Process Engineer researching, developing, and optimizing semiconductor unit processes (PEALD, ALD, PECVD, Epitaxy) for logic, memory, analog, power, and MEMS applications.
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Senior Engineer I, Key Account Technology
Asm
Tama(ASM Japan K.K.)
2mo
Senior product expert managing technical account aspects, leading NPI projects, and resolving high-value customer problems for semiconductor equipment.
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Senior Engineer I, Key Account Technology
Asm
Hsinchu (ASM Front-end Taiwan)
2mo
Senior Key Account Technology Engineer supporting new product introductions, escalations, and technical account management for semiconductor customers in Taiwan.
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Senior Engineer I, Process Engineering(PEALD)Japan
Asm
Tama(ASM Japan K.K.)
2mo
Develop new processes for semiconductor fabrication and troubleshoot complex process engineering issues in a cleanroom environment.
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Snr Global Product Support Engineer II
Asm
Shanghai(ASM China Ltd.)
2mo
Act as the single point of contact for customer technical issues, managing escalations from identification through root cause analysis and closure for semiconductor equipment.
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デモラボ・設備保全/工事管理
Asm
Tama(ASM Japan K.K.)
2mo
Manage utility equipment and cleanroom operations to ensure stable operation of semiconductor demonstration machines.
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Engineer I, Field Service
Asm
Kitakami(ASM Japan K.K.)
2mo
Installing, adjusting, and maintaining semiconductor process equipment inside customer cleanrooms.
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Engineer I, Field Service
Asm
Yokkaichi(ASM Japan K.K.)
2mo
Installing, adjusting, and maintaining semiconductor process equipment inside customer cleanrooms to ensure operational efficiency and uptime.
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Engineer II, Field Service
Asm
Kawasaki(ASM Japan K.K.)
2mo
Installing, adjusting, and maintaining semiconductor process equipment inside customer cleanrooms, with potential involvement in process development and improvement.
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Engineer II, Process Engineering
Asm
Tama(ASM Japan K.K.)
2mo
Develop new processes and technological innovations for semiconductor fabrication, specifically focusing on PECVD and related equipment.
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Senior Engineer I, Mechanical Engineering
Asm
Tama(ASM Japan K.K.)
2mo
System Engineer supporting the development, integration, and testing of advanced semiconductor equipment systems.
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Senior Engineer II, Global Product Support
Asm
Tama(ASM Japan K.K.)
2mo
Ensure performance, reliability, and success of advanced plasma-based semiconductor equipment through global customer-facing technical support and issue resolution.
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Senior Engineer II, Global Product Support
Asm
Tama(ASM Japan K.K.)
2mo
Provide expert-level technical support, diagnosis, and troubleshooting for advanced plasma-based semiconductor equipment (PECVD) for global customers.
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Manager/Director, Process Engineering
Asm
Tama(ASM Japan K.K.)
2mo
Manage and drive the process engineering function for ASM's Atomic Layer Deposition (ALD) technology, delivering next-generation systems to market and solving high-value customer problems.
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半導体装置フィールドサービスエンジニア・Field Service Engineer-Semiconductor Equipment
Asm
HigashiHiroshima(ASM Japan K.K.)
2mo
Install, adjust, and maintain semiconductor process equipment in customer cleanrooms, with potential involvement in process development and improvement.
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Senior Engineer II, Field Process
Asm
HigashiHiroshima(ASM Japan K.K.)
2mo
Lead complex process qualifications, resolve high-impact tool issues, and provide hands-on field engineering support for advanced semiconductor capital equipment at customer sites.
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Specialist II, Technical Training
Asm
AZ Lab (ASM America Inc.)
2mo
Deliver technical training and mentor engineers/technicians to operate and maintain complex semiconductor equipment and systems.
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Principal Engineer, Process Engineering
Asm
Singapore (ASM Front-End Mfg (S) Ltd)
2mo
Lead R&D research and optimization of semiconductor process technologies for Advanced Packaging, translating scientific insights into scalable solutions for next-generation devices.
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Senior Engineer II, Field Service
Asm
Shanghai(ASM China Ltd.)
2mo
Field Process Engineer responsible for customer site process support, new product installs, and site startup planning for semiconductor manufacturing tools.
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New College Grad - OPC Production Engineer Technician
Micron
Jalisco, Mexico
2mo
Entry-level engineer/technician processing reticle design data through Optical Proximity Correction (OPC) to enable photolithography printing in Production and R&D fabs.
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Senior Engineer, Equipment Engineering
Analogdevices
Ireland, Limerick
2mo
Wafer Fab Automation Engineer serving as the technical bridge between wafer-fab operations, equipment engineering, and automation development teams to deploy, integrate, and maintain robotics and AMHS systems.
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Quick response team engineer
ASML
Veldhoven, Netherlands
$59k–$66k
2mo
Provide immediate technical and operational solutions to disturbances on the Module Build production line to ensure continuity and delivery performance of advanced lithography system modules.
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Component Process Engineer
Lumilens
San Jose
2mo
Primary substrate engineering interface between hardware design, package manufacturing, and worldwide substrate suppliers for FR4/PCB development.
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Wafer Fab Process Engineer
Broadcom
Singapore-Depot Road
2mo
Lead process development, optimization, and transfer to manufacturing for thin film deposition, wafer thinning, thermal processes, and implantation to achieve yield, quality, cost, and reliability targets.
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OCT CMP Mfg. Alignment (MA) Engineer/Sr Engineer
Micron
Taichung - Fab 16, Taiwan
2mo
Optimize manufacturing tool utilization and standardize global processes for memory and storage production.
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Senior Engineer - DEMQRA Central Param / Characterization
Micron
Taichung - Fab 16, Taiwan
2mo
Manage param business processes and develop/deploy electrical device characterization programs for Global High-Volume-Manufacturing Fabs, supporting New-Product-Introduction via technology transfer.
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Wafer Fab Process Engineer
Broadcom
Singapore-Depot Road
2mo
Lead process development, optimization, and transfer to manufacturing for thin film deposition, wafer thinning, thermal oxidation, diffusion, and implantation to achieve yield, quality, cost, and reliability targets.
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Semiconductor Manufacturing Engineer (Segment Lead) (Contract)
Intel
Malaysia, Kulim
2mo
Segment Lead for semiconductor manufacturing execution, aligning customer demand, factory capacity, and supply chain operations to ensure delivery performance and business growth.
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Mechanical Engineer V - (E5)
Amat
Santa Clara,CA
$163k–$163k
2mo
Design, develop, and modify mechanical engineering layouts, schematics, and specifications for semiconductor capital equipment; oversee manufacturing and installation processes to resolve complex mechanical problems.
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Manufacturing Alignment Engineer (CVD/CMP)
Micron
Manassas, VA - Fab 6
2mo
Build alignment programs to standardize best-known methods, improve tool utilization, and optimize manufacturing performance across global semiconductor sites.
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III-V Wafer Fab Process Engineer (Lithography)
Broadcom
Singapore-Senoko
2mo
Developing, qualifying, and sustaining photolithography and etch processes for III-V compound semiconductor devices (InP, GaAs) to establish robust manufacturing, optimize yield, and support high-volume production.
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OPC Production Engineer
Micron
Jalisco, Mexico
2mo
Process reticle design data through Optical Proximity Correction (OPC) to ensure accurate transfer to silicon during photolithography for advanced semiconductor manufacturing.
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Process Support Engineer - Inline 3D X-ray
Amat
Shanghai,CHN
2mo
On-site Process Support Engineer for inline 3D X-ray inspection tools in semiconductor Advanced Packaging fabs, guiding products from concept to qualification and supporting hardware/software troubleshooting.
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Substrate Supplier Enablement Engineer
Intel
South Korea, Seoul
2mo
Lead substrate supplier development and qualification for advanced packaging technologies (high density FCBGA, EMIB-T, glass core) to enable new manufacturing capacity and support customer demand.
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Manufacturing – Production Engineer (Mechatronics) – Linkou
ASML
Linkou, Taiwan
2mo
Diagnose and resolve mechatronics issues in high-precision semiconductor equipment (stages, handlers, linear motors) to ensure stable factory output and system stability.
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Regional Technical Support Engineer
ASML
Shanghai, China
2mo
Provide higher-level technical analysis and solutions for escalated equipment and performance issues at customer sites for DUV systems.
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Engineer II, Field Service - 林口/桃園
Asm
Linkou(ASM Front-end Taiwan)
2mo
Field Service Engineer responsible for evaluating customer needs, resolving complex equipment issues, and leading site start-ups for semiconductor capital equipment.
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Foundry Engineer
Lightmatter
Boston, MA
$180k–$180k
2mo
Lead foundry process technology development, manufacturing strategies, and specifications for highly integrated photonics-based AI platforms and photonics chiplet communication fabrics.
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