Advanced Packaging Singulation Engineer
Core
Operate, optimize, and maintain high-volume semiconductor manufacturing equipment and processes to ensure control over critical dimensions and defectivity.
Role type
Senior IC manufacturing engineer (advanced packaging/singulation)
Builds
Integrated circuits and semiconductor modules
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (manufacturing equipment operation)
Required skills
Semiconductor metrology, process characterization, process improvement, manufacturing process controls, Design of Experiments (DOE), excursion management, semiconductor singulation processing
Preferred skills
Process analytical metrology, process development, statistics, experimental design methodologies, semiconductor process flows (logic/memory), project management
Technologies
DOE, excursion prevention systems
Responsibilities
Operate and optimize high-volume manufacturing equipment and processes; Conduct tests and measurements to evaluate equipment and process performance; Lead maintenance and repair activities for assigned equipment; Drive continuous improvement initiatives for safety, productivity, cost, and yield; Develop and implement excursion prevention systems; Support technology transfer through training and audits; Own installation, conversion, and qualification of equipment during factory ramps
Seniority
Senior, hands-on IC
