CareerPlan

Wafer Fab Process Engineer

Singapore-Depot RoadFull-time2026-07-22 → 2026-11-10

Core

Lead process development, optimization, and transfer to manufacturing for thin film deposition, wafer thinning, thermal oxidation, diffusion, and implantation to achieve yield, quality, cost, and reliability targets.

Role type

Senior IC wafer fab process engineer

Builds

Semiconductor manufacturing processes and integrated circuits

Domain

Semiconductor manufacturing / Wafer fabrication

Required skills

Thin film deposition, wafer thinning, thermal oxidation, diffusion, implantation, SPC, DOE, FMEA, statistical data analysis, root cause analysis, process control planning, cross-functional collaboration, mentoring

Preferred skills

PhD in Engineering, Six Sigma certification (Green/Black Belt), 4" to 6" wafer scaling experience

Technologies

None explicitly listed (tools like SPC/DOE are skills)

Responsibilities

Lead process development, optimization, and transfer to manufacturing; Own and drive advanced process modules (thin film deposition, wafer thinning, thermal processes); Lead yield improvement and defect reduction initiatives; Drive new process integration (NPI) and process transfer; Perform root cause analysis and implement corrective/preventive actions; Define process control plans, SPC strategies, and OCAP execution; Mentor junior engineers and technicians

Seniority

Senior, hands-on IC