Substrate Supplier Enablement Engineer
Core
Lead substrate supplier development and qualification for advanced packaging technologies (high density FCBGA, EMIB-T, glass core) to enable new manufacturing capacity and support customer demand.
Role type
Senior IC substrate supplier enablement engineer
Builds
Advanced packaging substrate and wafer assembly solutions for customers
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical Process Control (SPC), complex project management, high-volume manufacturing experience, process flow development, FMEA, DOE design, problem-solving tools
Preferred skills
Advanced packaging/substrates/semiconductor manufacturing knowledge, supplier management leadership, global team alignment, thriving in high-ambiguity environments
Technologies
high density FCBGA, EMIB-T, glass core substrate, component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi metal plating, defect inspection/metrology, electrical testing
Responsibilities
Collaborate with suppliers and internal teams to develop robust building block processes; Partner with on-site supplier engineering to advance substrate technologies; Ensure suppliers meet Product Control System commitments; Design and implement factory technology validation and product certification plans; Develop micro schedules for new factory startup activities; Lead qualification activities and monitor ramp indicators
Seniority
Senior, hands-on IC
