Principal Engineer, Process Engineering
Core
Lead R&D research and optimization of semiconductor process technologies for Advanced Packaging, translating scientific insights into scalable solutions for next-generation devices.
Role type
Principal IC Process Engineer (Advanced Packaging)
Builds
Scalable semiconductor process technologies for advanced packaging
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | research | infrastructure
Required skills
Thin-film deposition (ALD, PECVD, PVD, ECP), DOE-based experimental design, materials and process characterization, data analysis, electro/mechanical equipment operation
Preferred skills
Advanced packaging/interconnects research, statistical methods/DOE tools, materials characterization (SEM, TEM, XRD, ellipsometry), cross-disciplinary collaboration
Technologies
ALD, PECVD, PVD, ECP, SEM, TEM, XRD, ellipsometry
Responsibilities
Design and execute DOE-based experiments; characterize film quality and reliability; analyze experimental data and document results; troubleshoot process/equipment issues in lab/pilot environments; collaborate with cross-functional R&D teams; contribute to technology reviews and process improvement initiatives
Seniority
Principal, hands-on IC with research leadership
