Component Process Engineer
Core
Primary substrate engineering interface between hardware design, package manufacturing, and worldwide substrate suppliers for FR4/PCB development.
Role type
Component Process Engineer (FR4/PCB)
Builds
FR4 substrates and PCBs for high-speed optical transceiver applications
Domain
Hardware manufacturing / Photonics infrastructure / PCB engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
FR4 substrate development, PCB manufacturing, mSAP process, Any-Layer HDI process, DFM/DFT/DFR, failure analysis, reliability testing, supplier qualification, SMT, die attach, wire bond, active alignment, FMEA, Control Plan, SPC, 8D, PCB layout tools, mechanical design tools, statistical tools
Preferred skills
Optical transceiver manufacturing process, Six Sigma, Statistical Analysis
Technologies
Cadence, Solidworks, JMP
Responsibilities
Identify, develop and qualify FR4/PCB substrate suppliers worldwide; Lead DFM/DFT/DFR of PCB substrates, risk analysis and mitigation plan with suppliers; Lead FR4/PCB quality control, failure analysis and reliability tests; Engage with packaging production teams during the process development from SMT, die attach, wire bond, active alignment and testing
Seniority
Senior, hands-on IC
