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Process Engineering Intern

Tama(ASM Japan K.K.)💼 Internship🗓 2026-07-22 → 2026-09-26

Core

Analyze PEALD SiN gap-fill processes to identify effective deposition parameters and build physical/chemical models for performance improvement.

Role type

Process Engineering Intern (Semiconductor Manufacturing)

Builds

Deposition recipes and process models for semiconductor manufacturing

Domain

Semiconductor manufacturing / Chemical Vapor Deposition (CVD)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Process parameter analysis, Gap-fill capability (GPC) evaluation, Deposition recipe optimization, Experimental data analysis, Physical/chemical modeling

Preferred skills

Plasma process knowledge, Simulation capability, Materials Engineering background

Technologies

PEALD, SiN deposition, GPC profiling

Responsibilities

Review PEALD SiN gap-fill processes and determine specific recipe mechanisms, Analyze process sensitivity to identify effective parameters for gap-fill and throughput, Propose optimized recipes to achieve targets or maximize throughput, Build mechanism models using experimental data and theoretical models

Seniority

Intern

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