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Product & Design
› Semiconductor Product Engineering
Semiconductor Product Engineering
843 open positions
Technical Configuration Management III Sr. (TCM)
Amat
Austin,TX
$108k
1mo
Ensure accuracy, consistency, and traceability of product configurations for semiconductor equipment, serving as a liaison between Sales and internal stakeholders to optimize customer order hardware and software content.
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Product Engineer
ON Semiconductor
Shenzhen, Guangdong, China
1mo
Technical project leader responsible for the development and release of new power semiconductor products.
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Sr Mgr/Deputy Director, Aerospace & Defense End Market
GlobalFoundries
Santa Clara, US
1mo
Senior business development and market growth leader expanding GlobalFoundries' presence in aerospace, defense, space, national security, and critical infrastructure markets.
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Product Manager, Program Lead
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Lam Research
Bengaluru, Karnataka, India
1mo
End-to-end business owner for etch products, platforms, or major product families, owning strategy, roadmap, and delivery from concept through release.
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Sr Principle, Regional Marketing Analyst
ON Semiconductor
Scottsdale, AZ, United States
1mo
Define and drive technical strategy and collateral to increase awareness and adoption of the Power Solutions Group (PSG) portfolio, serving internal stakeholders, channel partners, and strategic customers.
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Product Engineer
ASML
Shenzhen, China
1mo
Technical liaison between customers and R&D, responsible for product feasibility studies, new feature definition, and providing technical support to field engineers and customers.
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Program Manager, Hardware R&D
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Nokia
Kanata, Ontario, Canada
1mo
Organize and manage intricate hardware development processes from prototypes to New Product Introduction (NPI), serving as a key liaison between internal teams and external suppliers.
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Business Development & Sales Manager to Xenergic
Nexer Recruit AB
Lund, Sweden
1mo
Drive international business development and sales for high-speed On-chip memory IP in the semiconductor industry, converting technical opportunities into strategic partnerships and design wins.
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Function Architect (f/m/x)
Zeissgroup
Jena
1mo
Translate system requirements into robust functional and module-level architectures for complex semiconductor systems, ensuring technical consistency from system decomposition through implementation.
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Junior Component Engineer – Electronics Manufacturing
Flir
US - Chestnut Ridge, NY
$73k
1mo
Supports component selection, alternate sourcing, lifecycle management, and supply chain risk mitigation for new and existing products.
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CDI - Ingénieur d'application Capteurs d'image (H/F)
STMicroelectronics
Grenoble, France
1mo
Provide direct technical support and reporting to key customers using advanced 2D image sensing products, help customers bring up and troubleshoot camera systems, and recommend optimal settings.
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Quantum PDK Design Manual Engineer
GlobalFoundries
USA - New York - Malta
$85k
1mo
Develop, implement, and improve processes, methodologies, and technical solutions for complex, novel engineering problems in semiconductor technology.
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Systems Engineer - Supervisors (Santa Clara/Dallas)
Texas Instruments
Dallas, TX, United States
1mo
Develop product strategies, define new products, and drive design wins for analog/mixed-signal ICs in automotive, industrial, consumer, and computing markets.
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Director, Sourcing (EDA/3PIP/Emulation)
Qualcomm
Santa Clara, California, United States of America
1mo
Director responsible for sourcing and managing Electronic Design Automation (EDA) tools and Third-Party IP for front-end and back-end design flows.
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Senior Engineer, Manufacturing Product
Lumentum
Thailand - Pathumthani (Navanakorn)
1mo
Drive product-engineering excellence and manufacturing execution for Cloud optical products, ensuring designs are manufacturable and scalable.
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Director, IC Packaging Engineering – Mechanical Simulation
Qualcomm
San Diego, California, United States of America
1mo
Lead a team of engineers delivering FEA-based mechanical simulation solutions for Qualcomm's current and next-generation chipsets and advanced packaging technologies.
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Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)
Micron
Fab 10A, Singapore
1mo
Drive package and HBM product engineering activities to improve assembly yield, reduce defects, and optimize manufacturing processes for next-generation High Bandwidth Memory products.
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Senior SiPh Product Development Engineer
Intel
US, Arizona, Phoenix
$164k–$232k
1mo
Lead the development and industrialization of next-generation silicon photonics and high-speed optical products from concept through high-volume manufacturing.
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Staff DRAM Product Line Manager
Micron
Boise, ID - Main Site, US
$129k
1mo
Coordinate P&L and drive revenue/market share for the vEIM DRAM product line serving embedded markets (Automotive, Industrial, Consumer).
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Principal Chipset Project Engineer – Hardware PCB/Platform Systems for Personal Compute (PC)
Qualcomm
San Diego, California, United States of America
1mo
Lead Platform/PCB strategy across the entire compute product portfolio, defining architecture and driving cost-optimized system decisions for Qualcomm's Personal Compute (PC) chipsets.
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IoT Chipset PE
Qualcomm
San Diego, California, United States of America
1mo
Plan and execute state-of-the-art Application Processor/Modem chipsets from concept to commercialization, ensuring hardware, software, and test delivery for customer devices.
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Senior Hardware Platform Expert (w/m/d)– Embedded Electronics
Siemens AG
Karlsruhe, Baden, BADEN_WUERTTEMBERG
1mo
Senior technical leader driving embedded electronics hardware platforms, technology scouting, and supplier management for industrial automation products.
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Staff Information Developer-Technical Writer
Arm
Cambridge, United Kingdom
1mo
Lead content development for silicon projects, planning and driving activities from requirements through customer delivery.
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Module Product Engineer
Renesas-Electronics
Austin, TEXAS, us
1mo
Own technical readiness, manufacturability, and lifecycle performance of advanced power modules from NPI through high-volume production.
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Principal Technologist
Asm
ID Boise (ASM America Inc.)
1mo
Lead advanced packaging technology engagement for key customer new products and applications penetration, driving module process and equipment improvements.
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ENGR STAFF, PACKAGE DEV : PKG & ASSY
ON Semiconductor
Carmona, Cavite, Philippines, Philippines
1mo
Lead new package development from conceptualization to functional prototypes, conducting POC builds, benchmarking technologies, and managing technical risks for semiconductor packaging solutions.
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Field Applications Engineer, Senior IoT - Qualcomm
Qualcomm
Issy Les Moulineaux, France
1mo
Provide highly visible customer support through the design, development, and adoption of products (hardware, software, RF, XR, IoT) by serving as a company liaison and instructing customers on system architectures.
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NAND Product Engineer
Apple
Cupertino, United States of America
1mo
Define Apple's mass storage solutions and drive technical impact on future product capabilities for flash memory.
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Specialist Technical writer
Infineon
Bangalore MG
1mo
Create, maintain, and publish high-quality technical content including datasheets, user manuals, application notes, and process guidelines for semiconductor solutions.
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Staff Product Application Engineer - Automotive MOSFET
Infineon
Padua (Padova)
1mo
Staff Product Application Engineer bridging cutting-edge semiconductor technology with customer needs to enable design-in and design-win for automotive MOSFET products.
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Patentanwalt / Patentanwältin (d/m/w/d)
ams-OSRAM International GmbH
Regensburg, BAYERN
1mo
In-house patent attorney building and managing a leading patent portfolio for digital photonics technologies in automotive, industry, consumer electronics, and datacommunications.
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Layout Engineer
Texas Instruments
Bengaluru, Karnataka, India
1mo
Develop and prepare multi-dimensional layouts and detailed drawings of semiconductor devices from schematics and geometry.
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Senior Principal Engineer, Global Product Management - Advanced Packaging
Asm
AZ Phoenix (ASM America Inc.)
1mo
Lead advanced packaging product platforms from concept through commercialization, defining roadmaps and engaging with semiconductor manufacturers to drive innovations in heterogeneous integration and chiplet architectures.
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Foundry Advanced Packaging Customer Engineer
Intel
US, Arizona, Phoenix
$220k–$311k
1mo
Develop and execute product strategies for advanced semiconductor packaging solutions, aligning with market trends and customer needs.
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Technical Account Manager - Strategic Customer Accounts
Siemens-Eda
Santa Clara, CA, United States
$188k
1mo
Own technical relationships and drive adoption/expansion for strategic semiconductor and EDA customer accounts.
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Strategic Marketing – Applied OLED BU
Appliedmaterials
Pyeongtaek-Mokok,KOR
1mo
Manages OLED development portfolios and programs from development through high-volume manufacturing, aligning product strategy with customer roadmaps and business growth targets.
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Senior Program Manager - (ASIC and technology development)
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MDA Space
Farnborough, England, UK
1mo
Lead complex ASIC and technology development programs from concept through design, validation, qualification, production, and customer delivery.
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Product Manager - Product Development
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Silex Microsystems
Järfälla, Stockholm County, Sweden
1mo
Lead MEMS product development from concept to prototype delivery, ensuring manufacturability and solving technical challenges.
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System Silicon Engineering Program Manager, iPhone
Apple
Cupertino, United States of America
1mo
Coordinate the definition and integration of custom silicon for iPhone, ensuring system integration goals are met and product risks are communicated.
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Senior Development Engineer (m/f/d) – Connection Technology (Electrical, Optical & Mechanical)
Zeissgroup
Oberkochen
1mo
Design, development, and evaluation of connection systems (optical, mechanical, electrical) for complex opto-mechatronic modules in semiconductor manufacturing equipment.
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Sr. Staff Manager, Product Engineering
Marvell
Santa Clara, CA
$144k–$215k
1mo
Lead a globally distributed team of product engineers to drive the productization and New Product Introduction (NPI) of high-speed datacenter connectivity solutions (PAM4 DSP, Coherent DSP) for cloud hyperscalers.
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Sr. Product Marketing Manager
Advanced Micro Devices, Inc
San Jose, California
1mo
Strategic product marketing professional supporting AMD's embedded processor portfolio, focusing on securing customer designs, guiding production ramps, and identifying market opportunities.
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半導体組立工程 技術開発エンジニア(2)
Renesas-Electronics
Yonezawa, jp
1mo
Developing next-generation semiconductor packaging technologies (Flip Chip, SiP) for AI/HPC, automotive, and IoT applications, focusing on high-density, high-reliability, and high-thermal-conductivity solutions.
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Product Marketing Engineer Intern- Server Telecom
Monolithicpower
San Jose, CA, US
1mo
Intern supporting the Product Marketing team in launching power semiconductor products and driving pricing strategies.
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Operations_Component Strategic Roadmap_Head
AdvanTech
Linkou, TW
1mo
Lead strategic component selection and lifecycle management for active components (CPU, IC, MCU, SoC, NPU, FPGA, DSP, ASIC, AI Accelerator, TPM) to ensure product health, supply stability, and future viability.
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Principal Product Engineer – High-Speed IP UCIE
Cadence
GYEONGGI-DO (Seoul)
1mo
Principal Product Engineer leading post-sales technical support, integration, and bring-up for high-speed interface IP (UCIe, PCIe, USB, etc.) at the customer level.
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New Product Project Manager
Cisco
San Jose, California, US
$143k
1mo
Guide next-generation silicon from early concept and prototyping through high-volume production, aligning schedules and ensuring quality/performance for Cisco Silicon One™ networking chips.
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Product Marketing II New College Grad (Gloucester, MA)
Amat
Gloucester,MA
$88k
1mo
Product marketing for ion implanter products serving the global semiconductor manufacturing industry, focusing on competitive intelligence, technical collateral, and product positioning.
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Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing)
↗
Micron Technology
Singapore, Singapore
1mo
Lead Media Health Manufacturing and test flow development for Micron's next-generation High Bandwidth Memory (HBM) products, focusing on DRAM, Interface, and Stacked Die architectures.
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Engineering Program Manager - SoC Silicon Group
Apple
Herzliya, Israel
1mo
Setting development goals and tracking project execution for Apple's new silicon product development (SoCs) across Pre-Silicon and Post-Silicon phases.
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