半導体組立工程 技術開発エンジニア(2)
Core
Developing next-generation semiconductor packaging technologies (Flip Chip, SiP) for AI/HPC, automotive, and IoT applications, focusing on high-density, high-reliability, and high-thermal-conductivity solutions.
Role type
Senior IC semiconductor assembly and packaging process engineer
Builds
Advanced packaging solutions (FCLGA, FCCSP, BGA) and assembly processes for high-performance computing and automotive chips
Domain
Semiconductor manufacturing / Electronics / Automotive / AI
Deliverable
production ML models | product features | infrastructure
Required skills
Semiconductor back-end process development (4+ years), SMT process development (4+ years), process improvement, quality management, equipment implementation, technical degree (Mechanical, Materials, Electronics, or Chemical)
Preferred skills
FPackage and high-density packaging process development, AI/HPC packaging development, automotive/IoT reliability testing, ISO/IATF compliance
Technologies
Solder paste printing, component mounting, FC Bond, reflow, flux cleaning, FCLGA, FCCSP, BGA
Responsibilities
Develop and evaluate advanced packaging technologies (FCLGA, FCCSP, BGA), develop and improve assembly processes (solder paste printing, component mounting, FC Bond, reflow, flux cleaning), support manufacturing line launch and mass production transition, improve process quality and yield
Seniority
Senior, hands-on IC
