Principal Technologist
Core
Lead advanced packaging technology engagement for key customer new products and applications penetration, driving module process and equipment improvements.
Role type
Principal Technologist (Advanced Packaging)
Builds
Advanced semiconductor packaging solutions for 5G, cloud computing, AI, and autonomous driving applications.
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | client delivery | infrastructure | physical/clinical work
Required skills
Advanced packaging process development, Thin Film/PECVD/LPCVD/ALD expertise, NPI program management, cross-functional collaboration, metrics development, team leadership
Preferred skills
Tool vendor experience, strong project management, analytical skills
Technologies
PECVD, LPCVD, ALD, Thin Film processes
Responsibilities
Lead advanced packaging technology engagement for key customer new products/applications penetration, maintain sustain application position with customer R&D and HVM teams, drive module process and equipment fundamental improvements, define overall NPI program schedules and drive execution plans, proactively identify talent and develop team members, develop metrics to measure NPI program performance, build strong cross-functional and matrixed relationships with Product Marketing, Product Development, and Service Engineering
Seniority
Principal, hands-on IC with strategic influence