Senior Principal Engineer, Global Product Management - Advanced Packaging
Core
Lead advanced packaging product platforms from concept through commercialization, defining roadmaps and engaging with semiconductor manufacturers to drive innovations in heterogeneous integration and chiplet architectures.
Role type
Senior Principal Engineer, Global Product Management (Advanced Packaging)
Builds
Advanced packaging solutions for next-generation semiconductor devices (AI, HPC, HBM, autonomous driving)
Domain
Semiconductor manufacturing / Advanced Packaging / Materials Science
Deliverable
product features
Required skills
Product lifecycle management, technology roadmap development, market requirements specification, strategic marketing, business case development, cross-functional technology leadership, ecosystem engagement, industry presence
Preferred skills
AI/HPC/HBM application support, hybrid bonding processes, semiconductor capital equipment product management
Technologies
Hybrid bonding, chiplet architectures, 2.5D/3D integration, HBM, wafer-to-wafer, die-to-wafer, TSVs, RDL
Responsibilities
Define and maintain product roadmaps for emerging advanced packaging applications; Develop strategic relationships with foundries and OSATs to understand technology requirements; Lead business planning and market readiness for new product launches; Monitor industry trends and competitor activity; Represent ASM at industry conferences and develop sales enablement materials
Seniority
Senior, hands-on IC with strategic oversight